JPS62184584U - - Google Patents
Info
- Publication number
- JPS62184584U JPS62184584U JP7315786U JP7315786U JPS62184584U JP S62184584 U JPS62184584 U JP S62184584U JP 7315786 U JP7315786 U JP 7315786U JP 7315786 U JP7315786 U JP 7315786U JP S62184584 U JPS62184584 U JP S62184584U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- recessed hole
- display block
- emitting display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
同実施例の断面図、第３図は同実施例の使用態様
の一例を示す斜視図、第４図は第３図の―線
拡大断面図、第５図は他の実施例の斜視図、第６
図は同実施例の断面図、第７図は従来例の断面図
である。 １……ケース、２……凹穴、３……内周面、４
，４′……リード（給電用電極）、５……ＬＥＤ
チツプ（発光素子）、７……光拡散剤入りの透光
性樹脂、８……光拡散剤無配合の透光性樹脂、Ａ
……発光表示ブロツク。
同実施例の断面図、第３図は同実施例の使用態様
の一例を示す斜視図、第４図は第３図の―線
拡大断面図、第５図は他の実施例の斜視図、第６
図は同実施例の断面図、第７図は従来例の断面図
である。 １……ケース、２……凹穴、３……内周面、４
，４′……リード（給電用電極）、５……ＬＥＤ
チツプ（発光素子）、７……光拡散剤入りの透光
性樹脂、８……光拡散剤無配合の透光性樹脂、Ａ
……発光表示ブロツク。
Claims (1)
- ケースの凹穴に発光素子を収納し、この発光素
子の給電用電極を設けた発光表示ブロツクにおい
て、上記凹穴の内周面を光反射面となすと共に、
上記凹穴の下部に光拡散剤入りの透光性樹脂を注
入して上記発光素子を封止したことを特徴とする
発光表示ブロツク。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7315786U JPS62184584U (ja) | 1986-05-15 | 1986-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7315786U JPS62184584U (ja) | 1986-05-15 | 1986-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62184584U true JPS62184584U (ja) | 1987-11-24 |
Family
ID=30917238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7315786U Pending JPS62184584U (ja) | 1986-05-15 | 1986-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62184584U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005244259A (ja) * | 2005-05-23 | 2005-09-08 | Nichia Chem Ind Ltd | 発光ダイオード |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313089B2 (ja) * | 1974-02-18 | 1978-05-08 | ||
| JPS5430798A (en) * | 1977-08-12 | 1979-03-07 | Fujitsu Ltd | Manufacture of luminous display element |
| JPS5512244B2 (ja) * | 1977-10-21 | 1980-03-31 | ||
| JPS5549503B2 (ja) * | 1977-02-07 | 1980-12-12 |
-
1986
- 1986-05-15 JP JP7315786U patent/JPS62184584U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313089B2 (ja) * | 1974-02-18 | 1978-05-08 | ||
| JPS5549503B2 (ja) * | 1977-02-07 | 1980-12-12 | ||
| JPS5430798A (en) * | 1977-08-12 | 1979-03-07 | Fujitsu Ltd | Manufacture of luminous display element |
| JPS5512244B2 (ja) * | 1977-10-21 | 1980-03-31 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005244259A (ja) * | 2005-05-23 | 2005-09-08 | Nichia Chem Ind Ltd | 発光ダイオード |