JPH0385669U - - Google Patents

Info

Publication number
JPH0385669U
JPH0385669U JP14763089U JP14763089U JPH0385669U JP H0385669 U JPH0385669 U JP H0385669U JP 14763089 U JP14763089 U JP 14763089U JP 14763089 U JP14763089 U JP 14763089U JP H0385669 U JPH0385669 U JP H0385669U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
view
sectional
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14763089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14763089U priority Critical patent/JPH0385669U/ja
Publication of JPH0385669U publication Critical patent/JPH0385669U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】
第１図は本願考案に係る発光ダイオードの縦断
面図、第２図は第１図の平面的断面図、第３図は
他の実施例の縦断面図、第４図は第１図における
発光の軌跡を示す縦断面図、第５図は第３図にお
ける発光の軌跡を示す縦断面図、第６図は従来の
発光ダイオードの縦断面図、第７図は第６図の平
面断面図を示している。第８図は従来の発光ダイ
オードの縦断面図、第９図は従来の発光ダイオー
ドの縦断面図、第１０図は第８図の発光ダイオー
ドにおける発光の軌跡を示す図面、第１１図は第
９図の発光ダイオードにおける発光の軌跡を示す
図面、第１２図は本願考案の場合における基本的
光学的等価図、第１３図は従来技術における基本
的光学的等価図である。 １……ＬＥＤチツプ、２……導電性接着材、３
……リードピン、４……導線、５……封止材、６
……インナーレンズ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 封止材の屈折率とは異なる屈折率を有するイン
    ナーレンズを１枚または複数枚ＬＥＤチツプの近
    傍の位置に封止してあることを特徴とするインナ
    ーレンズ付き発光ダイオード。
JP14763089U 1989-12-21 1989-12-21 Pending JPH0385669U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14763089U JPH0385669U (ja) 1989-12-21 1989-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14763089U JPH0385669U (ja) 1989-12-21 1989-12-21

Publications (1)

Publication Number Publication Date
JPH0385669U true JPH0385669U (ja) 1991-08-29

Family

ID=31694135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14763089U Pending JPH0385669U (ja) 1989-12-21 1989-12-21

Country Status (1)

Country Link
JP (1) JPH0385669U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116194A (ja) * 1995-10-17 1997-05-02 Alps Electric Co Ltd 発光ダイオード装置
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (ja) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp 半導体発光装置
JPS6222491A (ja) * 1985-07-23 1987-01-30 Toshiba Corp 半導体発光装置
JPS6482681A (en) * 1987-09-25 1989-03-28 Stanley Electric Co Ltd Compound lens type photodetector/light emitting element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (ja) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp 半導体発光装置
JPS6222491A (ja) * 1985-07-23 1987-01-30 Toshiba Corp 半導体発光装置
JPS6482681A (en) * 1987-09-25 1989-03-28 Stanley Electric Co Ltd Compound lens type photodetector/light emitting element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116194A (ja) * 1995-10-17 1997-05-02 Alps Electric Co Ltd 発光ダイオード装置
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード

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