JPH0383960U - - Google Patents

Info

Publication number
JPH0383960U
JPH0383960U JP14533889U JP14533889U JPH0383960U JP H0383960 U JPH0383960 U JP H0383960U JP 14533889 U JP14533889 U JP 14533889U JP 14533889 U JP14533889 U JP 14533889U JP H0383960 U JPH0383960 U JP H0383960U
Authority
JP
Japan
Prior art keywords
chip
lens
lead frames
led chip
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14533889U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14533889U priority Critical patent/JPH0383960U/ja
Publication of JPH0383960U publication Critical patent/JPH0383960U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】
第１図は本考案による斜め照射型ＬＥＤの一実
施例を示すもので、Ａは概略断面図、Ｂは発光特
性を示すグラフ。第２図及び第３図はそれぞれ第
１図のＬＥＤを利用したＬＥＤランプの構成を示
し、第２図のＡはその概略断面図、Ｂ及びＣはそ
れぞれ発光特性を示すグラフ、第３図Ａは概略平
面図、Ｂは概略断面図である。第４図は従来のＬ
ＥＤの一例を示し、Ａは概略断面図、Ｂは発光特
性を示すグラフ。第５図は従来のＬＥＤランプの
一例を示し、Ａは概略平面図、Ｂは概略断面図で
ある。 １０……斜め射出型ＬＥＤ、１１，１２……リ
ードフレーム、１３……ＬＥＤチツプ、１４……
レンズ、１５……プリント基板、２０……ＬＥＤ
ランプ、２１……プリント基板。

Claims (1)

  1. 【実用新案登録請求の範囲】 実質的に上下に平行に延びる二本のリードフレ
    ームと、該リードフレームの一方の上端面に取り
    付けられ且つその上面が他方のリードフレームの
    上端に対してワイヤボンデイングされているＬＥ
    Ｄチツプと、該ＬＥＤチツプを包囲するように樹
    脂モールドにより成形されたレンズとを含むＬＥ
    Ｄにおいて、 レンズの光軸が、ＬＥＤチツプの中心から外れ
    ていることにより、光照射方向が傾斜しているこ
    とを特徴とする斜め照射型ＬＥＤ。
JP14533889U 1989-12-15 1989-12-15 Pending JPH0383960U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14533889U JPH0383960U (ja) 1989-12-15 1989-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14533889U JPH0383960U (ja) 1989-12-15 1989-12-15

Publications (1)

Publication Number Publication Date
JPH0383960U true JPH0383960U (ja) 1991-08-26

Family

ID=31691977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14533889U Pending JPH0383960U (ja) 1989-12-15 1989-12-15

Country Status (1)

Country Link
JP (1) JPH0383960U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003288808A (ja) * 2002-03-27 2003-10-10 Shashin Denki Kogyo Kk 照明器具
JP2004349628A (ja) * 2003-05-26 2004-12-09 Sharp Corp 半導体発光装置及びそれを用いた撮影用照明装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003288808A (ja) * 2002-03-27 2003-10-10 Shashin Denki Kogyo Kk 照明器具
JP2004349628A (ja) * 2003-05-26 2004-12-09 Sharp Corp 半導体発光装置及びそれを用いた撮影用照明装置

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