JPS648759U - - Google Patents
Info
- Publication number
- JPS648759U JPS648759U JP1987103780U JP10378087U JPS648759U JP S648759 U JPS648759 U JP S648759U JP 1987103780 U JP1987103780 U JP 1987103780U JP 10378087 U JP10378087 U JP 10378087U JP S648759 U JPS648759 U JP S648759U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- diode element
- chip
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第1図は本考案の一実施例に係るチツプ型LE
Dを示す斜視図、第2図は第1図に示すチツプ型
LEDのA−A断面図、第3図は第1図に示すチ
ツプ型LEDのB−B断面図、第4図及び第5図
は第1図に示すチツプ型LEDの応用例を示す図
、第6図は第1図に示すチツプ型LEDの一部変
更例を示す斜視図、第7図は従来のチツプ型LE
Dを示す斜視図、第8図は第7図に示すチツプ型
LEDの実装例を示す図である。 1,2,11,12……電極パターン、3,1
3……絶縁基板、4,14……LED素子、5,
15……レンズ部、15a……上面、15b……
側面、15c,15d……左右側面、16……反
射部、16a,16b,16c……反射面。
Dを示す斜視図、第2図は第1図に示すチツプ型
LEDのA−A断面図、第3図は第1図に示すチ
ツプ型LEDのB−B断面図、第4図及び第5図
は第1図に示すチツプ型LEDの応用例を示す図
、第6図は第1図に示すチツプ型LEDの一部変
更例を示す斜視図、第7図は従来のチツプ型LE
Dを示す斜視図、第8図は第7図に示すチツプ型
LEDの実装例を示す図である。 1,2,11,12……電極パターン、3,1
3……絶縁基板、4,14……LED素子、5,
15……レンズ部、15a……上面、15b……
側面、15c,15d……左右側面、16……反
射部、16a,16b,16c……反射面。
Claims (1)
- 【実用新案登録請求の範囲】 絶縁基板と、該絶縁基板上に設けられた電極パ
ターンと、該電極パターン上に実装された発光ダ
イオード素子とからなるチツプ型発光ダイオード
において、 前記絶縁基板に実装された発光ダイオード素子
を透光性樹脂により被覆してレンズ部を形成し、
該レンズ部の側方の一面を除くすべての面を囲む
ように反射部を設け、前記発光ダイオード素子が
発する光を前記側方の一面に集めて照射するよう
にしたことを特徴とするチツプ型発光ダイオード
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987103780U JPS648759U (ja) | 1987-07-06 | 1987-07-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987103780U JPS648759U (ja) | 1987-07-06 | 1987-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS648759U true JPS648759U (ja) | 1989-01-18 |
Family
ID=31334916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987103780U Pending JPS648759U (ja) | 1987-07-06 | 1987-07-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS648759U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03127874A (ja) * | 1989-10-05 | 1991-05-30 | Dialight Corp | サーフェスマウントledパッケージ |
JP2001094157A (ja) * | 1999-09-24 | 2001-04-06 | Sharp Corp | チップ部品型発光ダイオードおよびその製造方法 |
JP2009527122A (ja) * | 2006-02-14 | 2009-07-23 | エルジー イノテック カンパニー リミテッド | 発光装置及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5829857B2 (ja) * | 1976-10-29 | 1983-06-25 | レブロン・インコ−ポレイテツド | 感温装置 |
-
1987
- 1987-07-06 JP JP1987103780U patent/JPS648759U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5829857B2 (ja) * | 1976-10-29 | 1983-06-25 | レブロン・インコ−ポレイテツド | 感温装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03127874A (ja) * | 1989-10-05 | 1991-05-30 | Dialight Corp | サーフェスマウントledパッケージ |
JP2001094157A (ja) * | 1999-09-24 | 2001-04-06 | Sharp Corp | チップ部品型発光ダイオードおよびその製造方法 |
JP2009527122A (ja) * | 2006-02-14 | 2009-07-23 | エルジー イノテック カンパニー リミテッド | 発光装置及びその製造方法 |
JP2012134531A (ja) * | 2006-02-14 | 2012-07-12 | Lg Innotek Co Ltd | 発光装置 |
US8269224B2 (en) | 2006-02-14 | 2012-09-18 | Lg Innotek Co., Ltd. | Light emitting device and method for manufacturing the same |
US9455385B2 (en) | 2006-02-14 | 2016-09-27 | Lg Innotek Co., Ltd. | Light emitting device and method for manufacturing the same |