JPS62101250U - - Google Patents

Info

Publication number
JPS62101250U
JPS62101250U JP1985191047U JP19104785U JPS62101250U JP S62101250 U JPS62101250 U JP S62101250U JP 1985191047 U JP1985191047 U JP 1985191047U JP 19104785 U JP19104785 U JP 19104785U JP S62101250 U JPS62101250 U JP S62101250U
Authority
JP
Japan
Prior art keywords
light emitting
substrate
wiring pattern
emitting diode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985191047U
Other languages
English (en)
Other versions
JPH0517894Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985191047U priority Critical patent/JPH0517894Y2/ja
Publication of JPS62101250U publication Critical patent/JPS62101250U/ja
Application granted granted Critical
Publication of JPH0517894Y2 publication Critical patent/JPH0517894Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Surface Treatment Of Optical Elements (AREA)

Description

【図面の簡単な説明】
第１図は、本考案によるＬＥＤ発光装置の一実
施例を示す分解斜視図、第２図は、本考案による
ＬＥＤ発光装置の要部を示す反射層が形成された
基板の平面図、第３図は、第２図のＡ部の拡大断
面図である。 １…ＬＥＤ発光装置、２…基板、３…配線パタ
ーン、４…発光ダイオードチツプ、９…電極、１
０…金属細線、１１…反射層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上に形成された配線パターンと、該配線パ
    ターンの所定位置に形成され、複数の発光ダイオ
    ードチツプがボンデイングされるとともに、前記
    発光ダイオードチツプとの間を短絡接続させる金
    属細線が配設された電極と、を有するＬＥＤ発光
    装置において、少なくとも前記基板表面の電極の
    周囲には光の反射層が形成されていることを特徴
    とするＬＥＤ発光装置。
JP1985191047U 1985-12-13 1985-12-13 Expired - Lifetime JPH0517894Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985191047U JPH0517894Y2 (ja) 1985-12-13 1985-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985191047U JPH0517894Y2 (ja) 1985-12-13 1985-12-13

Publications (2)

Publication Number Publication Date
JPS62101250U true JPS62101250U (ja) 1987-06-27
JPH0517894Y2 JPH0517894Y2 (ja) 1993-05-13

Family

ID=31144827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985191047U Expired - Lifetime JPH0517894Y2 (ja) 1985-12-13 1985-12-13

Country Status (1)

Country Link
JP (1) JPH0517894Y2 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057446A (ja) * 1999-06-09 2001-02-27 Sanyo Electric Co Ltd 混成集積回路装置
JP2001230450A (ja) * 2000-02-21 2001-08-24 Hiroshi Ninomiya 面発光体の製造方法
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
JP2009164210A (ja) * 2007-12-28 2009-07-23 Hitachi Ltd 実装基板、及びこの実装基板を備えるｌｅｄ光源装置
JP2010103294A (ja) * 2008-10-23 2010-05-06 Citizen Electronics Co Ltd 発光ダイオード
JP2011091405A (ja) * 2009-10-26 2011-05-06 Gio Optoelectronics Corp 発光装置
JP2016157770A (ja) * 2015-02-24 2016-09-01 東洋紡株式会社 発光ダイオード素子の実装基板用白色反射フィルム、その発光ダイオード素子の実装基板用白色反射フィルム用いてなる発光ダイオード素子の実装基板並びにその発光ダイオード素子の実装基板を用いてなる照明器具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103482U (ja) * 1980-12-17 1982-06-25
JPS5877071U (ja) * 1981-11-17 1983-05-24 三洋電機株式会社 発光ダイオ−ド表示器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103482U (ja) * 1980-12-17 1982-06-25
JPS5877071U (ja) * 1981-11-17 1983-05-24 三洋電機株式会社 発光ダイオ−ド表示器

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057446A (ja) * 1999-06-09 2001-02-27 Sanyo Electric Co Ltd 混成集積回路装置
JP2001230450A (ja) * 2000-02-21 2001-08-24 Hiroshi Ninomiya 面発光体の製造方法
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
JP2009164210A (ja) * 2007-12-28 2009-07-23 Hitachi Ltd 実装基板、及びこの実装基板を備えるｌｅｄ光源装置
JP2010103294A (ja) * 2008-10-23 2010-05-06 Citizen Electronics Co Ltd 発光ダイオード
JP2011091405A (ja) * 2009-10-26 2011-05-06 Gio Optoelectronics Corp 発光装置
JP2016157770A (ja) * 2015-02-24 2016-09-01 東洋紡株式会社 発光ダイオード素子の実装基板用白色反射フィルム、その発光ダイオード素子の実装基板用白色反射フィルム用いてなる発光ダイオード素子の実装基板並びにその発光ダイオード素子の実装基板を用いてなる照明器具

Also Published As

Publication number Publication date
JPH0517894Y2 (ja) 1993-05-13

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