JPS6349945U - - Google Patents

Info

Publication number
JPS6349945U
JPS6349945U JP14286786U JP14286786U JPS6349945U JP S6349945 U JPS6349945 U JP S6349945U JP 14286786 U JP14286786 U JP 14286786U JP 14286786 U JP14286786 U JP 14286786U JP S6349945 U JPS6349945 U JP S6349945U
Authority
JP
Japan
Prior art keywords
light emitting
diode array
emitting diode
group
thin metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14286786U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14286786U priority Critical patent/JPS6349945U/ja
Publication of JPS6349945U publication Critical patent/JPS6349945U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例の光プリンタヘツドの要
部平面図ａと断面図ｂ、第２図は従来の光プリン
タヘツドの斜視図である。 １…基板、１４，１４…配線パターン、２…発
光ダイオードアレイ、２１，２１…発光部、３，
３…駆動素子、４，４…台座、５，５…（第１群
の）金属細線、６，６…（第２群の）金属細線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板と、基板上に載置され、整列された多数の
    発光部を有する発光ダイオードアレイと、発光ダ
    イオードの近傍の基板上に載置された発光部を点
    灯駆動する駆動素子と、発光ダイオードアレイと
    駆動素子の間の基板上に設けられた配線パターン
    と、配線パターンの上方に設けられ、表面に多数
    のワイヤボンド領域を有した台座と、発光ダイオ
    ードアレイと配線パターンと駆動素子を配線する
    第１群の金属細線と、第１群の金属細線と交互に
    設けられ発光ダイオードアレイと台座と駆動素子
    を配線する第２群の金属細線とを具備した事を特
    徴とする光プリンタヘツド。
JP14286786U 1986-09-17 1986-09-17 Pending JPS6349945U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14286786U JPS6349945U (ja) 1986-09-17 1986-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14286786U JPS6349945U (ja) 1986-09-17 1986-09-17

Publications (1)

Publication Number Publication Date
JPS6349945U true JPS6349945U (ja) 1988-04-05

Family

ID=31052009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14286786U Pending JPS6349945U (ja) 1986-09-17 1986-09-17

Country Status (1)

Country Link
JP (1) JPS6349945U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222248A (ja) * 2005-02-10 2006-08-24 Rohm Co Ltd 半導体発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222248A (ja) * 2005-02-10 2006-08-24 Rohm Co Ltd 半導体発光装置
JP4679917B2 (ja) * 2005-02-10 2011-05-11 ローム株式会社 半導体発光装置

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