JPS62180538U - - Google Patents

Info

Publication number
JPS62180538U
JPS62180538U JP1986068511U JP6851186U JPS62180538U JP S62180538 U JPS62180538 U JP S62180538U JP 1986068511 U JP1986068511 U JP 1986068511U JP 6851186 U JP6851186 U JP 6851186U JP S62180538 U JPS62180538 U JP S62180538U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
substrate
driving element
diode arrays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986068511U
Other languages
English (en)
Other versions
JPH0517249Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986068511U priority Critical patent/JPH0517249Y2/ja
Publication of JPS62180538U publication Critical patent/JPS62180538U/ja
Application granted granted Critical
Publication of JPH0517249Y2 publication Critical patent/JPH0517249Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

【図面の簡単な説明】
第１図は、本考案実施例の光プリンタヘツドの
平面図、第２図は従来の光プリンタヘツドの斜視
図である。 １……基板、４，４……駆動素子、５，５……
発光ダイオードアレイ、６，６……ワイヤーボン
デイングパツト用素子（台座）、８，８……金属
細線。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 基板と、基板上に整列配置された複数の発
    光ダイオードアレイと、発光ダイオードアレイの
    列に沿つて基板上に設けられた発光ダイオードア
    レイの駆動素子と、発光ダイオードアレイの列と
    駆動素子の間の基板上に設けられ、表面に多数の
    ワイヤボンド領域を有した台座と、発光ダイオー
    ドアレイと台座と駆動素子とを配線する金属細線
    とを具備した事を特徴とする光プリンタヘツド。 (2) 前記台座は表面に電極膜を有した半導体で
    ある事を特徴とする前記実用新案登録請求の範囲
    第１項記載の光プリンタヘツド。
JP1986068511U 1986-05-07 1986-05-07 Expired - Lifetime JPH0517249Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986068511U JPH0517249Y2 (ja) 1986-05-07 1986-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986068511U JPH0517249Y2 (ja) 1986-05-07 1986-05-07

Publications (2)

Publication Number Publication Date
JPS62180538U true JPS62180538U (ja) 1987-11-16
JPH0517249Y2 JPH0517249Y2 (ja) 1993-05-10

Family

ID=30908392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986068511U Expired - Lifetime JPH0517249Y2 (ja) 1986-05-07 1986-05-07

Country Status (1)

Country Link
JP (1) JPH0517249Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59148340U (ja) * 1983-03-25 1984-10-03 沖電気工業株式会社 発光出力補正装置
JPS6118848U (ja) * 1984-07-06 1986-02-03 三洋電機株式会社 光プリントヘツド

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124228A (en) * 1978-03-22 1979-09-27 Toshiba Corp Parent-and-child type transformer for use in meters

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59148340U (ja) * 1983-03-25 1984-10-03 沖電気工業株式会社 発光出力補正装置
JPS6118848U (ja) * 1984-07-06 1986-02-03 三洋電機株式会社 光プリントヘツド

Also Published As

Publication number Publication date
JPH0517249Y2 (ja) 1993-05-10

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