JPS59148340U - 発光出力補正装置 - Google Patents

発光出力補正装置

Info

Publication number
JPS59148340U
JPS59148340U JP4204883U JP4204883U JPS59148340U JP S59148340 U JPS59148340 U JP S59148340U JP 4204883 U JP4204883 U JP 4204883U JP 4204883 U JP4204883 U JP 4204883U JP S59148340 U JPS59148340 U JP S59148340U
Authority
JP
Japan
Prior art keywords
led
array
led array
trimming
correction device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4204883U
Other languages
English (en)
Inventor
孝志 江川
博司 古谷
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP4204883U priority Critical patent/JPS59148340U/ja
Publication of JPS59148340U publication Critical patent/JPS59148340U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Analogue/Digital Conversion (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Facsimile Heads (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は、トリミングの対象となるＬＥＤアレイの実装
立体図、第２図ａは、トリミング前の抵抗付きＬＥＤア
レイの発光出力と各ＬＥＤの両端の端子電圧の測定図、
第２図すは、この時のブロック図を示す。第３図ａ及び
ｂは、Ｐ−Ｉ特性、Ｉ−Ｖ特性から求めた近似直線を表
わす各ＬＥＤ個別の定数Ａｋ、Ｂｋ、Ｃｋ、Ｄｋの関係
を示す。第４図ａ及びｂは、それぞれトリミング前のＬ
ＥＤの発光出カー順方向電流特性、順方向電流−順バイ
アス電圧特性を示す。第５図は、抵抗のトリミングの方
法を示す。 １・・・ＬＥＤアレイ、１ａ・・・ＬＥＤ素子、２・・
・ワイヤーボンディング、３・・・共通ライン、３””
”共通端子、３ｂ・・・スルーホール穴、４・・・トリ
ミングされる抵抗アレイ、４ａ・・・トリミングされる
抵抗素子、５・・・印刷基板、６・・・厚膜導体、７・
・・受光ダイオード、８・・・定軍流供給プローブ、９
・・・電圧測定用プローブ、１０・・・レーザービーム
集束レンズ、１１・・・レーザービーム、１２・・・抵
抗測定器。 基２図（（１） ／ 基２図ｃｂ）

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）長尺形状の印刷基板の第１層面の長尺方向に沿っ
    て、複数個のＬＥＤアレイを整列配置し、前記ＬＥＤア
    レイの共通電極であるベース下部にスルホール穴を介し
    て前記印刷基板の第２層面のＬＥＤアレイ選択用の共通
    端子に導かれる印刷配線を有し、前記ＬＥＤアレイのア
    ノード端子と前記印刷配線上の導体とが配線され、ＬＥ
    Ｄ素子対応毎に抵抗アレイ群が印刷されて前記導体に接
    続されているＬＥＤアレイヘッドにおいて、順次ＬＥＤ
    アレイに通電電流を通電し当該通電されたＬＥＤアレイ
    の光出力を検出する回路と、当該光出力をＡ／Ｄ変換す
    る回路と、前記通電されたＬＥＤアレイのＬＥＤ順バイ
    アス電圧を検出する回路と、当該検出された順バイアス
    電圧と前記Ａ／Ｄ変換された光出力を演算し、前記抵抗
    アレイ群のそれぞれの抵抗値の最適値を求め、当該抵抗
    値をトリミングする手段とを有し、’ＬＥＤの輝度バラ
    ツキを補正することを特徴とする発光出力補正装置。
  2. （２）抵抗値をトリミングする手段がレーザビームによ
    るトリミング手段であることを特徴とする実用新案登録
    請求の範囲第１項記載の発光出力補正装置。
JP4204883U 1983-03-25 1983-03-25 発光出力補正装置 Pending JPS59148340U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4204883U JPS59148340U (ja) 1983-03-25 1983-03-25 発光出力補正装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4204883U JPS59148340U (ja) 1983-03-25 1983-03-25 発光出力補正装置

Publications (1)

Publication Number Publication Date
JPS59148340U true JPS59148340U (ja) 1984-10-03

Family

ID=30172608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4204883U Pending JPS59148340U (ja) 1983-03-25 1983-03-25 発光出力補正装置

Country Status (1)

Country Link
JP (1) JPS59148340U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180538U (ja) * 1986-05-07 1987-11-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180538U (ja) * 1986-05-07 1987-11-16

Similar Documents

Publication Publication Date Title
JP2650236B2 (ja) Ｌｅｄアレイ光源の製造方法
JPS59148340U (ja) 発光出力補正装置
JPS59148341U (ja) 発光出力補正装置
JPS60179057U (ja) 発光ダイオード
JPS58209265A (ja) 発光ダイオ−ドアレイ装置
JPS5814502A (ja) 認識マ−クを備えたチツプ抵抗器
JPS6113958U (ja) 発光ダイオ−ドランプ
JPS59173356U (ja) 発光ダイオ−ドランプ
JPS6413166U (ja)
JPS62208965A (ja) Ｌｅｄプリンタ用ｌｅｄアレ−ヘツド
JPS61104566U (ja)
JPS6226875A (ja) 発光ダイオ−ドユニツト
JPS60181959U (ja) 原稿読取装置における棒状固体光源
JPS60185351U (ja) チツプ型発光ダイオ−ド
JPH01153658U (ja)
JPH0328529Y2 (ja)
JPS6189958U (ja)
JPH02131363U (ja)
JPS5945691U (ja) 発行ダイオ−ド表示ユニット
JPS60142832U (ja) 光学式ピツクアツプ装置
JPS5982291U (ja) Ｌｅｄ信号レベル表示装置
JPH08220U (ja) 駆動素子接続体
JPS6125150U (ja) 光プリンタヘツド
JPS6039259U (ja) 発光ダイオ−ドランプ
JPS6449886U (ja)