JPS60179057U - 発光ダイオード - Google Patents

発光ダイオード

Info

Publication number
JPS60179057U
JPS60179057U JP1984065769U JP6576984U JPS60179057U JP S60179057 U JPS60179057 U JP S60179057U JP 1984065769 U JP1984065769 U JP 1984065769U JP 6576984 U JP6576984 U JP 6576984U JP S60179057 U JPS60179057 U JP S60179057U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
chip
resistor
resistance value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984065769U
Other languages
English (en)
Other versions
JPH0414941Y2 (ja
Inventor
長崎　彰
Original Assignee
株式会社　シチズン電子
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　シチズン電子 filed Critical 株式会社　シチズン電子
Priority to JP1984065769U priority Critical patent/JPS60179057U/ja
Publication of JPS60179057U publication Critical patent/JPS60179057U/ja
Application granted granted Critical
Publication of JPH0414941Y2 publication Critical patent/JPH0414941Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の抵抗内蔵タイプの発光グイオードを示す
図、第２図は本考案の一実施例を示す斜視図、第３図は
本考案の内部回路を示す図、第４図は抵抗値の修正方法
を示す図、第５図は抵抗値修正の作業工程の一例を示す
図である。 １・・・アルミナ基板、２・・・電極パターン、３・・
・発光ダイオードチップ、４・・・抵抗体、５・・・透
明樹脂、１０・・・チップＬＥＤランプ、１１・・・プ
ローブ針、１３・・・センサー。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁、耐熱性のあるアルミナ基板と、発光ダイオードチ
    ップとから構成されているチップランプにおいて、印刷
    にて形成された電流制限用抵抗体の抵抗値をサンドブラ
    スト法やレーザー法等により修正することを特徴とする
    抵抗付きチップランプ。
JP1984065769U 1984-05-04 1984-05-04 発光ダイオード Granted JPS60179057U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984065769U JPS60179057U (ja) 1984-05-04 1984-05-04 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984065769U JPS60179057U (ja) 1984-05-04 1984-05-04 発光ダイオード

Publications (2)

Publication Number Publication Date
JPS60179057U true JPS60179057U (ja) 1985-11-28
JPH0414941Y2 JPH0414941Y2 (ja) 1992-04-03

Family

ID=30598059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984065769U Granted JPS60179057U (ja) 1984-05-04 1984-05-04 発光ダイオード

Country Status (1)

Country Link
JP (1) JPS60179057U (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080877A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd Ｌｅｄ光源の色調補正方法
JP2009277705A (ja) * 2008-05-12 2009-11-26 Koa Corp パッケージ発光部品およびその製造法
JP2011014695A (ja) * 2009-07-01 2011-01-20 Sharp Corp 発光装置および発光装置の製造方法
JP2013048163A (ja) * 2011-08-29 2013-03-07 Seiwa Electric Mfg Co Ltd 半導体発光素子、発光装置及び半導体発光素子の製造方法
US8723195B2 (en) 2010-01-22 2014-05-13 Sharp Kabushiki Kaisha Light emitting device with plurality of LED chips and/or electrode wiring pattern
US9024334B2 (en) 2009-11-13 2015-05-05 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429653U (ja) * 1977-07-29 1979-02-27
JPS5918454U (ja) * 1982-07-27 1984-02-04 株式会社シチズン電子 リ−ドレス発光ダイオ−ド

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429653B2 (ja) * 1971-08-31 1979-09-25
JPS5918454B2 (ja) * 1980-04-21 1984-04-27 住友重機械工業株式会社 高炉ダスト，製鋼炉ダストを主体とするダストの均一化混合貯蔵方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429653U (ja) * 1977-07-29 1979-02-27
JPS5918454U (ja) * 1982-07-27 1984-02-04 株式会社シチズン電子 リ−ドレス発光ダイオ−ド

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080877A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd Ｌｅｄ光源の色調補正方法
JP2009277705A (ja) * 2008-05-12 2009-11-26 Koa Corp パッケージ発光部品およびその製造法
JP2011014695A (ja) * 2009-07-01 2011-01-20 Sharp Corp 発光装置および発光装置の製造方法
US9024334B2 (en) 2009-11-13 2015-05-05 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
US9231023B2 (en) 2009-11-13 2016-01-05 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
US8723195B2 (en) 2010-01-22 2014-05-13 Sharp Kabushiki Kaisha Light emitting device with plurality of LED chips and/or electrode wiring pattern
US9093357B2 (en) 2010-01-22 2015-07-28 Sharp Kabushiki Kaisha Light emitting device
US9312304B2 (en) 2010-01-22 2016-04-12 Sharp Kabushiki Kaisha LED illuminating device comprising light emitting device including LED chips on single substrate
US9425236B2 (en) 2010-01-22 2016-08-23 Sharp Kabushiki Kaisha Light emitting device
US9679942B2 (en) 2010-01-22 2017-06-13 Sharp Kabushiki Kaisha Light emitting device
US9966367B2 (en) 2010-01-22 2018-05-08 Sharp Kabushiki Kaisha Light emitting device
JP2013048163A (ja) * 2011-08-29 2013-03-07 Seiwa Electric Mfg Co Ltd 半導体発光素子、発光装置及び半導体発光素子の製造方法

Also Published As

Publication number Publication date
JPH0414941Y2 (ja) 1992-04-03

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