JPS6457050U - - Google Patents
Info
- Publication number
- JPS6457050U JPS6457050U JP1987152314U JP15231487U JPS6457050U JP S6457050 U JPS6457050 U JP S6457050U JP 1987152314 U JP1987152314 U JP 1987152314U JP 15231487 U JP15231487 U JP 15231487U JP S6457050 U JPS6457050 U JP S6457050U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- base
- diode array
- emitting diode
- emitting parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第１図は本考案実施例の光プリンタヘツドの要
部斜視図、第２図は従来の光プリンタヘツドの要
部平面図である。 ２……発光ダイオードアレイ、２２……発光部
、２３……個別電極、２５……細帯状電極、４…
…細線、５，３１……配線部。
部斜視図、第２図は従来の光プリンタヘツドの要
部平面図である。 ２……発光ダイオードアレイ、２２……発光部
、２３……個別電極、２５……細帯状電極、４…
…細線、５，３１……配線部。
Claims (1)
- 化合物半導体の基台と、その基台の表面に整列
して設けられた複数の発光部と、発光部とオーミ
ツク接触し発光部の整列方向と略直交するよう延
在し、ワイヤボンド部を有して基台表面に設けら
れた個別電極とを有した発光ダイオードアレイと
、その発光ダイオードアレイの近傍に設けられた
配線部と、個別電極のワイヤボンド部と配線部と
を接続する細線とを具備した光プリンタヘツドに
おいて、前記発光ダイオードアレイの基台表面に
は前記個別電極の延長上に細帯状電極が設けてあ
る事を特徴とする光プリンタヘツド。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987152314U JPS6457050U (ja) | 1987-10-05 | 1987-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987152314U JPS6457050U (ja) | 1987-10-05 | 1987-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457050U true JPS6457050U (ja) | 1989-04-10 |
Family
ID=31427126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987152314U Pending JPS6457050U (ja) | 1987-10-05 | 1987-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457050U (ja) |
-
1987
- 1987-10-05 JP JP1987152314U patent/JPS6457050U/ja active Pending