JPS636853U - - Google Patents
Info
- Publication number
- JPS636853U JPS636853U JP1986098755U JP9875586U JPS636853U JP S636853 U JPS636853 U JP S636853U JP 1986098755 U JP1986098755 U JP 1986098755U JP 9875586 U JP9875586 U JP 9875586U JP S636853 U JPS636853 U JP S636853U
- Authority
- JP
- Japan
- Prior art keywords
- wiring conductor
- light emitting
- emitting diodes
- printer head
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Description
第１図は本考案の光プリンタヘツドの一部を示
す平面図、第２図は第１図の縦断面図、第３図は
従来の光プリンタヘツドの一部分を示す平面図、
第４図は第３図の縦断面図である。 １，１１……絶縁基板、２，１２……発光ダイ
オード、３，１３……駆動用ＩＣ素子、４，１４
……配線導体、６……グレーズ層。
す平面図、第２図は第１図の縦断面図、第３図は
従来の光プリンタヘツドの一部分を示す平面図、
第４図は第３図の縦断面図である。 １，１１……絶縁基板、２，１２……発光ダイ
オード、３，１３……駆動用ＩＣ素子、４，１４
……配線導体、６……グレーズ層。
Claims (1)
- 電気絶縁性基板の一主面上に直線状に配列した
複数個の発光ダイオードと、該発光ダイオードに
一端が接続された配線導体と、前記配線導体の他
端に接続された駆動用ＩＣ素子とを取着搭載して
成る光プリンタヘツドにおいて、前記配線導体の
下部にグレーズ層を配したことを特徴とする光プ
リンタヘツド。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098755U JPH0435178Y2 (ja) | 1986-06-26 | 1986-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986098755U JPH0435178Y2 (ja) | 1986-06-26 | 1986-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636853U true JPS636853U (ja) | 1988-01-18 |
| JPH0435178Y2 JPH0435178Y2 (ja) | 1992-08-20 |
Family
ID=30967007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986098755U Expired JPH0435178Y2 (ja) | 1986-06-26 | 1986-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0435178Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012516539A (ja) * | 2009-01-30 | 2012-07-19 | ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー | 立体リソグラフィ装置用の照明システム |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS612509A (ja) * | 1984-06-15 | 1986-01-08 | 株式会社クボタ | 塑性材料の連続ロ−ルプレス法 |
-
1986
- 1986-06-26 JP JP1986098755U patent/JPH0435178Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS612509A (ja) * | 1984-06-15 | 1986-01-08 | 株式会社クボタ | 塑性材料の連続ロ−ルプレス法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012516539A (ja) * | 2009-01-30 | 2012-07-19 | ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー | 立体リソグラフィ装置用の照明システム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0435178Y2 (ja) | 1992-08-20 |