JPS6388809U - - Google Patents

Info

Publication number
JPS6388809U
JPS6388809U JP1986182595U JP18259586U JPS6388809U JP S6388809 U JPS6388809 U JP S6388809U JP 1986182595 U JP1986182595 U JP 1986182595U JP 18259586 U JP18259586 U JP 18259586U JP S6388809 U JPS6388809 U JP S6388809U
Authority
JP
Japan
Prior art keywords
led array
substrate
light emitting
flip
emitting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986182595U
Other languages
English (en)
Other versions
JPH059698Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986182595U priority Critical patent/JPH059698Y2/ja
Priority to US07/102,537 priority patent/US4827290A/en
Priority to DE19873739964 priority patent/DE3739964A1/de
Publication of JPS6388809U publication Critical patent/JPS6388809U/ja
Application granted granted Critical
Publication of JPH059698Y2 publication Critical patent/JPH059698Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Dot-Matrix Printers And Others (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の一実施例を示すＬＥＤアレ
ーヘツドの構造断面図、第２図は同光フアイバー
の断面図、第３図は通常のＬＥＤプリンタの構成
を説明する概略構成図であり、第４図は従来のＬ
ＥＤアレーヘツドの構造断面図である。 １１……透明基板、１３……ＬＥＤチツプ、１
３ａ……発光部、１６……フアイバー束、１７…
…光フアイバー。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＬＥＤアレーを選択的に発光させるＬＥＤアレ
    ーヘツドにおいて、前記ＬＥＤアレーを基板上に
    発光部が該基板面と対向するようにフリツプチツ
    プ形式により実装すると共に、前記基板に前記Ｌ
    ＥＤアレーの発光部と一端部が近接する複数の光
    フアイバーよりなるフアイバー束を埋設したこと
    を特徴とするＬＥＤアレーヘツド。
JP1986182595U 1986-11-27 1986-11-27 Expired - Lifetime JPH059698Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1986182595U JPH059698Y2 (ja) 1986-11-27 1986-11-27
US07/102,537 US4827290A (en) 1986-11-27 1987-09-29 LED array head using a fiber bundle
DE19873739964 DE3739964A1 (de) 1986-11-27 1987-11-25 Led-anordnungs-kopf

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986182595U JPH059698Y2 (ja) 1986-11-27 1986-11-27

Publications (2)

Publication Number Publication Date
JPS6388809U true JPS6388809U (ja) 1988-06-09
JPH059698Y2 JPH059698Y2 (ja) 1993-03-10

Family

ID=16121031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986182595U Expired - Lifetime JPH059698Y2 (ja) 1986-11-27 1986-11-27

Country Status (3)

Country Link
US (1) US4827290A (ja)
JP (1) JPH059698Y2 (ja)
DE (1) DE3739964A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006039046A (ja) * 2004-07-23 2006-02-09 Shinko Electric Ind Co Ltd 光導波路装着部材、基板、半導体装置、光導波路装着部材の製造方法、及び基板の製造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929965A (en) * 1987-09-02 1990-05-29 Alps Electric Co. Optical writing head
US4928122A (en) * 1988-01-21 1990-05-22 Fuji Photo Film Co., Ltd. Exposure head
US4951064A (en) * 1989-05-15 1990-08-21 Westinghouse Electric Corp. Thin film electroluminescent edge emitter assembly and integral packaging
US4980701A (en) * 1989-07-03 1990-12-25 Eastman Kodak Company Non-impact printhead using a mask with a dye sensitive to and adjusted by light in a first spectrum to balance the transmission of light in a second spectrum emitted by an LED array
KR0137190B1 (ko) * 1992-12-03 1998-04-28 모리시타 요이찌 완전밀착형이미지센서 및 완전밀착형이미지센서유닛
US5561451A (en) * 1993-01-27 1996-10-01 Sony Corporation Sublimation type printer and photographic paper therefor
US5463229A (en) * 1993-04-07 1995-10-31 Mitsui Toatsu Chemicals, Incorporated Circuit board for optical devices
US5882533A (en) * 1996-07-15 1999-03-16 Industrial Technology Research Institute Field emission based print head
US6784463B2 (en) * 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
BE1013248A3 (nl) 2000-01-26 2001-11-06 Krypton Electronic Eng Nv Optisch apparaat.
JP3883770B2 (ja) * 2000-03-07 2007-02-21 パイオニア株式会社 発光素子の製造方法
US6486561B1 (en) * 2000-09-12 2002-11-26 Luminary Logic, Ltd. Semiconductor light emitting element formed on a clear or translucent substrate
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
US20040206970A1 (en) * 2003-04-16 2004-10-21 Martin Paul S. Alternating current light emitting device
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
JP6374739B2 (ja) * 2014-09-19 2018-08-15 株式会社沖データ 露光装置及び画像形成装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074A (ja) * 1982-07-05 1984-01-17 Nippon Telegr & Teleph Corp <Ntt> 画像処理方式
JPS6162016A (ja) * 1984-09-03 1986-03-29 Nhk Spring Co Ltd Ｌｅｄプリンタヘツド

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968564A (en) * 1975-04-30 1976-07-13 Northern Electric Company Limited Alignment of optical fibers to light emitting diodes
JPS5946740A (ja) * 1982-09-09 1984-03-16 Ricoh Co Ltd 光書込デバイス
JPS5986395A (ja) * 1982-11-09 1984-05-18 Toshiba Corp 光制御装置
DE3438949C2 (de) * 1983-10-25 1994-03-10 Canon Kk Druckvorrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074A (ja) * 1982-07-05 1984-01-17 Nippon Telegr & Teleph Corp <Ntt> 画像処理方式
JPS6162016A (ja) * 1984-09-03 1986-03-29 Nhk Spring Co Ltd Ｌｅｄプリンタヘツド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006039046A (ja) * 2004-07-23 2006-02-09 Shinko Electric Ind Co Ltd 光導波路装着部材、基板、半導体装置、光導波路装着部材の製造方法、及び基板の製造方法
JP4558400B2 (ja) * 2004-07-23 2010-10-06 新光電気工業株式会社 半導体装置

Also Published As

Publication number Publication date
DE3739964A1 (de) 1988-06-09
US4827290A (en) 1989-05-02
JPH059698Y2 (ja) 1993-03-10

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