JPS63101549U - - Google Patents
Info
- Publication number
- JPS63101549U JPS63101549U JP1986203213U JP20321386U JPS63101549U JP S63101549 U JPS63101549 U JP S63101549U JP 1986203213 U JP1986203213 U JP 1986203213U JP 20321386 U JP20321386 U JP 20321386U JP S63101549 U JPS63101549 U JP S63101549U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- metal base
- printer head
- optical printer
- holding members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Laser Beam Printer (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第1図は本考案の光プリンタヘツドの一実施例
を示す断面図、第2図は第1図の光プリンタヘツ
ドに使用される絶縁基板の一部を示す平面図、第
3図は従来の光プリンタヘツドの断面図である。 1:金属基体、2:蓋体、3:絶縁基板、4:
発光ダイオード、5:駆動用IC素子、8:保持
部材。
を示す断面図、第2図は第1図の光プリンタヘツ
ドに使用される絶縁基板の一部を示す平面図、第
3図は従来の光プリンタヘツドの断面図である。 1:金属基体、2:蓋体、3:絶縁基板、4:
発光ダイオード、5:駆動用IC素子、8:保持
部材。
Claims (1)
- 上面に複数個の発光ダイオードが直線状に配列
搭載されている絶縁基板を金属基体上に固定して
成る光プリンタヘツドにおいて、前記絶縁基板を
一対の保持部材で挾持し、かつ該保持部材を金属
基体に取着することによつて絶縁基板を金属基体
上に固定したことを特徴とする光プリンタヘツド
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986203213U JPS63101549U (ja) | 1986-12-23 | 1986-12-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986203213U JPS63101549U (ja) | 1986-12-23 | 1986-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63101549U true JPS63101549U (ja) | 1988-07-01 |
Family
ID=31168332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986203213U Pending JPS63101549U (ja) | 1986-12-23 | 1986-12-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63101549U (ja) |
-
1986
- 1986-12-23 JP JP1986203213U patent/JPS63101549U/ja active Pending