JPS6247155U - - Google Patents

Info

Publication number
JPS6247155U
JPS6247155U JP1985139672U JP13967285U JPS6247155U JP S6247155 U JPS6247155 U JP S6247155U JP 1985139672 U JP1985139672 U JP 1985139672U JP 13967285 U JP13967285 U JP 13967285U JP S6247155 U JPS6247155 U JP S6247155U
Authority
JP
Japan
Prior art keywords
metal base
light source
utility
light emitting
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985139672U
Other languages
English (en)
Other versions
JPH0412698Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985139672U priority Critical patent/JPH0412698Y2/ja
Publication of JPS6247155U publication Critical patent/JPS6247155U/ja
Application granted granted Critical
Publication of JPH0412698Y2 publication Critical patent/JPH0412698Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例の線状光源の斜視図、第
２図は本考案の他の実施例の線状光源の側面断面
図、第３図は従来の線状光源の斜視図である。 １，１１……金属基台、１ａ，１１ａ……折曲
短片、２，２……１２，１２……発光ダイオード
、３，１３……可撓性基板、４，１４……駆動素
子、１５……反射枠。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 略Ｌ字状をなす金属基台と、その金属基台
    の折曲短片の外側に向く面上に整列して載置され
    た複数の発光ダイオードと、金属基台に載置され
    た発光ダイオードの駆動素子とを具備した事を特
    徴とする線状光源。 (2) 前記金属基板には配線パターンを有する可
    撓性基板が貼付してある事を特徴とする前記実用
    新案登録請求の範囲第１項記載の線状光源。
JP1985139672U 1985-09-12 1985-09-12 Expired JPH0412698Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985139672U JPH0412698Y2 (ja) 1985-09-12 1985-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985139672U JPH0412698Y2 (ja) 1985-09-12 1985-09-12

Publications (2)

Publication Number Publication Date
JPS6247155U true JPS6247155U (ja) 1987-03-23
JPH0412698Y2 JPH0412698Y2 (ja) 1992-03-26

Family

ID=31045795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985139672U Expired JPH0412698Y2 (ja) 1985-09-12 1985-09-12

Country Status (1)

Country Link
JP (1) JPH0412698Y2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135508A (ja) * 2006-11-28 2008-06-12 Seiko Epson Corp 光源装置、プロジェクタ及びモニタ装置
JP2008270462A (ja) * 2007-04-19 2008-11-06 Stanley Electric Co Ltd 光デバイス
JP2010226733A (ja) * 2010-04-21 2010-10-07 Mitsubishi Electric Corp 画像読取装置
JP2011523180A (ja) * 2008-06-04 2011-08-04 フォーエバー・バルブ・リミテッド・ライアビリティ・カンパニー Ｌｅｄ電球装置
JP2012527761A (ja) * 2009-05-20 2012-11-08 ティーピー ビジョン ホールディング ビー ヴィ 周辺光を提供するプリント回路板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135508A (ja) * 2006-11-28 2008-06-12 Seiko Epson Corp 光源装置、プロジェクタ及びモニタ装置
JP2008270462A (ja) * 2007-04-19 2008-11-06 Stanley Electric Co Ltd 光デバイス
JP2011523180A (ja) * 2008-06-04 2011-08-04 フォーエバー・バルブ・リミテッド・ライアビリティ・カンパニー Ｌｅｄ電球装置
JP2012527761A (ja) * 2009-05-20 2012-11-08 ティーピー ビジョン ホールディング ビー ヴィ 周辺光を提供するプリント回路板
JP2010226733A (ja) * 2010-04-21 2010-10-07 Mitsubishi Electric Corp 画像読取装置

Also Published As

Publication number Publication date
JPH0412698Y2 (ja) 1992-03-26

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