JPH01171055U - - Google Patents
Info
- Publication number
- JPH01171055U JPH01171055U JP1988068345U JP6834588U JPH01171055U JP H01171055 U JPH01171055 U JP H01171055U JP 1988068345 U JP1988068345 U JP 1988068345U JP 6834588 U JP6834588 U JP 6834588U JP H01171055 U JPH01171055 U JP H01171055U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light
- insulating substrate
- type bidirectional
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は本考案の一実施例に係るチツプ型双方
向発光ダイオードを示す斜視図、第２図は第１図
に示すチツプ型双方向発光ダイオードの回路図で
ある。 １……絶縁基板、２，３……電極、４，５……
発光ダイオード素子、６，７……ワイヤー、８…
…レンズ部。
向発光ダイオードを示す斜視図、第２図は第１図
に示すチツプ型双方向発光ダイオードの回路図で
ある。 １……絶縁基板、２，３……電極、４，５……
発光ダイオード素子、６，７……ワイヤー、８…
…レンズ部。
Claims (1)
- 絶縁基板上に一対の電極を形成し、発光ダイオ
ード素子を実装したチツプ型発光ダイオードにお
いて、２個又は複数個の発光ダイオード素子を逆
並列に実装したことを特徴とするチツプ型双方向
発光ダイオード。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988068345U JPH01171055U (ja) | 1988-05-24 | 1988-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988068345U JPH01171055U (ja) | 1988-05-24 | 1988-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171055U true JPH01171055U (ja) | 1989-12-04 |
Family
ID=31293668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988068345U Pending JPH01171055U (ja) | 1988-05-24 | 1988-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171055U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207649A (ja) * | 2002-12-26 | 2004-07-22 | Rohm Co Ltd | 発光装置及び照明装置 |
| JP2006190764A (ja) * | 2005-01-05 | 2006-07-20 | Stanley Electric Co Ltd | 表面実装型ｌｅｄ |
| JP2011187661A (ja) * | 2010-03-08 | 2011-09-22 | Hiroshi Ninomiya | ベアチップ実装面発光体及びその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927363B1 (ja) * | 1969-01-08 | 1974-07-17 | ||
| JPS52129391A (en) * | 1976-04-23 | 1977-10-29 | Mitsubishi Electric Corp | Light emitting diode |
| JPS6210456B2 (ja) * | 1980-12-10 | 1987-03-06 | Sanyo Denki Kk |
-
1988
- 1988-05-24 JP JP1988068345U patent/JPH01171055U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927363B1 (ja) * | 1969-01-08 | 1974-07-17 | ||
| JPS52129391A (en) * | 1976-04-23 | 1977-10-29 | Mitsubishi Electric Corp | Light emitting diode |
| JPS6210456B2 (ja) * | 1980-12-10 | 1987-03-06 | Sanyo Denki Kk |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207649A (ja) * | 2002-12-26 | 2004-07-22 | Rohm Co Ltd | 発光装置及び照明装置 |
| JP2006190764A (ja) * | 2005-01-05 | 2006-07-20 | Stanley Electric Co Ltd | 表面実装型ｌｅｄ |
| JP2011187661A (ja) * | 2010-03-08 | 2011-09-22 | Hiroshi Ninomiya | ベアチップ実装面発光体及びその製造方法 |