JPS6361161U - - Google Patents

Info

Publication number
JPS6361161U
JPS6361161U JP1986155375U JP15537586U JPS6361161U JP S6361161 U JPS6361161 U JP S6361161U JP 1986155375 U JP1986155375 U JP 1986155375U JP 15537586 U JP15537586 U JP 15537586U JP S6361161 U JPS6361161 U JP S6361161U
Authority
JP
Japan
Prior art keywords
semiconductor light
emitting device
lens
light emitting
bonding wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986155375U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986155375U priority Critical patent/JPS6361161U/ja
Publication of JPS6361161U publication Critical patent/JPS6361161U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案半導体発光素子の第１実施例を
示す平面図、第２図はその側面図、第３図は本考
案半導体発光素子の第２実施例を示す平面図、第
４図はその側面図、第５図は本考案半導体発光素
子の第３実施例を示す平面図、第６図はその側面
図、第７図および第８図は各々従来の半導体発光
素子の構造を示す側面図である。 １……基台、２……半導体発光素子チツプ、３
……電極、４……配線部、５……レンズ、６……
接着剤、７……ボンデイングワイヤ、８……電極
。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体発光素子チツプ上にレンズを配置してな
    る半導体発光素子において、 上記半導体発光素子チツプ上面の少なくとも２
    箇所と、該素子チツプを載置する基台の電極部と
    を、各々ボンデイングワイヤで接続し、 かつ、これらのボンデイングワイヤの挟む空間
    にレンズを挿入して、該レンズの側周を該ボンデ
    イングワイヤにより挟持した状態で、該レンズを
    素子チツプ上に載置固着することを特徴とする半
    導体発光素子。
JP1986155375U 1986-10-09 1986-10-09 Pending JPS6361161U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986155375U JPS6361161U (ja) 1986-10-09 1986-10-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986155375U JPS6361161U (ja) 1986-10-09 1986-10-09

Publications (1)

Publication Number Publication Date
JPS6361161U true JPS6361161U (ja) 1988-04-22

Family

ID=31076020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986155375U Pending JPS6361161U (ja) 1986-10-09 1986-10-09

Country Status (1)

Country Link
JP (1) JPS6361161U (ja)

Similar Documents

Publication Publication Date Title
JPS6361161U (ja)
JPS62101250U (ja)
JPS6320464U (ja)
JPH01171055U (ja)
JPH01169056U (ja)
JPS63200355U (ja)
JPS6413743U (ja)
JPH0436238U (ja)
JPH0347141U (ja)
JPS6364035U (ja)
JPH01176950U (ja)
JPH0268440U (ja)
JPS6429827U (ja)
JPH029430U (ja)
JPH0272567U (ja)
JPS63155652U (ja)
JPS6276535U (ja)
JPS63201346U (ja)
JPS5995652U (ja) 発光素子
JPS6282734U (ja)
JPS6279291U (ja)
JPH01165657U (ja)
JPH0159637U (ja)
JPS6049654U (ja) 二色発光半導体装置
JPS63193836U (ja)