JPS6049654U - 二色発光半導体装置 - Google Patents

二色発光半導体装置

Info

Publication number
JPS6049654U
JPS6049654U JP1983141390U JP14139083U JPS6049654U JP S6049654 U JPS6049654 U JP S6049654U JP 1983141390 U JP1983141390 U JP 1983141390U JP 14139083 U JP14139083 U JP 14139083U JP S6049654 U JPS6049654 U JP S6049654U
Authority
JP
Japan
Prior art keywords
emitting semiconductor
light
light emitting
semiconductor device
color light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983141390U
Other languages
English (en)
Inventor
根来　立彦
進 武田
浜田　直仁
Original Assignee
スタンレー電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スタンレー電気株式会社 filed Critical スタンレー電気株式会社
Priority to JP1983141390U priority Critical patent/JPS6049654U/ja
Publication of JPS6049654U publication Critical patent/JPS6049654U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の二色発光半導体装置を示す一部断面側面
図、第２図は第１図に示す装置の結線図、第３図乃至第
７図はこの考案の装置に係わるもので第３図は一実施例
を示す一部断面側面図、第４図は同じ（平面図、第５図
は同じく斜視図、第６図は第３図に示した装置の結線図
、第７図は他の実施例を示す一部断面側面図である。 ８．９・・・リード端子、８ａ、９ａ・・・上端面、１
０・・・レンズ部、１１．１２・・・発光半導体チップ
、１１ａ、１２ａ・・・裏面電極、ｌｌｂ、１２ｂ−・
・表面電極。 第４図　　　　　　第５図 第６図　　　　　第７図

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光色の異なる２個の発光半導体チップを互に異なる極
    性の裏面電極側で一方のリード端子の上端面にグイボン
    ドし、前記各発光半導体チップの表面電極は他方のリー
    ド端子の上端面にワイドボンドするとともに１．前記各
    発光半導体チップを一体に透光性の樹脂によってモール
    ドしてレンズ部を形成したことを特徴とする二色発光半
    導体装置。
JP1983141390U 1983-09-14 1983-09-14 二色発光半導体装置 Pending JPS6049654U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983141390U JPS6049654U (ja) 1983-09-14 1983-09-14 二色発光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983141390U JPS6049654U (ja) 1983-09-14 1983-09-14 二色発光半導体装置

Publications (1)

Publication Number Publication Date
JPS6049654U true JPS6049654U (ja) 1985-04-08

Family

ID=30316243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983141390U Pending JPS6049654U (ja) 1983-09-14 1983-09-14 二色発光半導体装置

Country Status (1)

Country Link
JP (1) JPS6049654U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566557A (en) * 1979-06-29 1981-01-23 Nippon Telegr & Teleph Corp <Ntt> Telephone with redialing function
JPS58132985A (ja) * 1982-01-29 1983-08-08 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン 光放出器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566557A (en) * 1979-06-29 1981-01-23 Nippon Telegr & Teleph Corp <Ntt> Telephone with redialing function
JPS58132985A (ja) * 1982-01-29 1983-08-08 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン 光放出器

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