JPS60109344U - チツプ化半導体素子 - Google Patents
チツプ化半導体素子Info
- Publication number
- JPS60109344U JPS60109344U JP20169783U JP20169783U JPS60109344U JP S60109344 U JPS60109344 U JP S60109344U JP 20169783 U JP20169783 U JP 20169783U JP 20169783 U JP20169783 U JP 20169783U JP S60109344 U JPS60109344 U JP S60109344U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor device
- chipped
- emitting diode
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本考案のチップ化半導体素子の一実施例の斜視
図、第２図及び第３図は本考案のチップ化半導体素子の
縦断側面図である。 。 １・・・絶縁体基板、２，３・・・接続用の電極部、８
・・・半導体チップ、１０・・・透明な樹脂。
図、第２図及び第３図は本考案のチップ化半導体素子の
縦断側面図である。 。 １・・・絶縁体基板、２，３・・・接続用の電極部、８
・・・半導体チップ、１０・・・透明な樹脂。
Claims (1)
- それぞれ表裏両面の各一部にまで延長されているような
パターンを有する接続用の電極部が２つの端面に設けら
れている絶縁体基板における表面側に、前記した接続用
の電極部の延長部に発光ダイオードチップ、あるいはフ
ォトダイオードチップ、もしくはフォトトランジスタチ
ップを接続し、前記した発光ダイオードチップ、あるい
はフォトダイオードチップ、もしくはフォトトランジス
タチップなどの半導体チップを、透明な樹脂材料でドー
ム状に包囲してなるチップ化半導体素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20169783U JPS60109344U (ja) | 1983-12-26 | 1983-12-26 | チツプ化半導体素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20169783U JPS60109344U (ja) | 1983-12-26 | 1983-12-26 | チツプ化半導体素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60109344U true JPS60109344U (ja) | 1985-07-25 |
Family
ID=30763731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20169783U Pending JPS60109344U (ja) | 1983-12-26 | 1983-12-26 | チツプ化半導体素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60109344U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62185382A (ja) * | 1986-02-08 | 1987-08-13 | Copal Co Ltd | 発光素子アレイ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55107283A (en) * | 1979-02-09 | 1980-08-16 | Matsushita Electric Ind Co Ltd | Luminous diode |
-
1983
- 1983-12-26 JP JP20169783U patent/JPS60109344U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55107283A (en) * | 1979-02-09 | 1980-08-16 | Matsushita Electric Ind Co Ltd | Luminous diode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62185382A (ja) * | 1986-02-08 | 1987-08-13 | Copal Co Ltd | 発光素子アレイ |
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