JPS55107283A - Luminous diode - Google Patents

Luminous diode

Info

Publication number
JPS55107283A
JPS55107283A JP1474179A JP1474179A JPS55107283A JP S55107283 A JPS55107283 A JP S55107283A JP 1474179 A JP1474179 A JP 1474179A JP 1474179 A JP1474179 A JP 1474179A JP S55107283 A JPS55107283 A JP S55107283A
Authority
JP
Japan
Prior art keywords
recess
diode
block
metallic
luminous diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1474179A
Other languages
Japanese (ja)
Other versions
JPS6043040B2 (en
Inventor
Hitoshi Haga
Toru Nakayama
Yoshitaka Kumagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP54014741A priority Critical patent/JPS6043040B2/en
Publication of JPS55107283A publication Critical patent/JPS55107283A/en
Publication of JPS6043040B2 publication Critical patent/JPS6043040B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To enable a luminous diode to be handled easily, by forming a recess on top of an insulation block, providing 2 metallic layers extending from the recess's bottom surface to the reverse side of the block passing through the block's side surface, and using these as a diode's lead being fixed onto one of the metallic layers. CONSTITUTION:A recess 6 is formed on top of an insulation block A having a rectangular shape, and 2 separate metallic layers 1' and 2', which extend from the recess's bottom to a part of the reverse side through the top covering the bottom and the block A's side surface, are also formed. A luminous diode 3 is attached onto a section located in the bottom surface of the recess 6 on a metallic layer 1', and an electrode provided on the diode 3 is connected to the other metallic layer 2' using a small metallic wire 4. And then, the recess 6 is filled with a light-pervious resin in such a manner as to cover the diode 3 and the small metallic wire 4 so that all of these become united into one body. By doing so, it is possible to prevent the lead from sticking to outside and from bending and also to improve its reliability.
JP54014741A 1979-02-09 1979-02-09 light emitting diode Expired JPS6043040B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54014741A JPS6043040B2 (en) 1979-02-09 1979-02-09 light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54014741A JPS6043040B2 (en) 1979-02-09 1979-02-09 light emitting diode

Publications (2)

Publication Number Publication Date
JPS55107283A true JPS55107283A (en) 1980-08-16
JPS6043040B2 JPS6043040B2 (en) 1985-09-26

Family

ID=11869535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54014741A Expired JPS6043040B2 (en) 1979-02-09 1979-02-09 light emitting diode

Country Status (1)

Country Link
JP (1) JPS6043040B2 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500880A (en) * 1981-07-16 1983-05-26 “エルコズ”エレクトロエク　コンサルティング　サ−ビスィズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング optoelectronic components
JPS599564U (en) * 1982-07-09 1984-01-21 清水　亮太郎 leadless light emitting diode
JPS60109344U (en) * 1983-12-26 1985-07-25 日本ビクター株式会社 chipped semiconductor device
JPH0258356U (en) * 1988-10-21 1990-04-26
JPH0267664U (en) * 1988-11-11 1990-05-22
JPH058960U (en) * 1991-07-15 1993-02-05 スタンレー電気株式会社 Surface mount LED
JPH10150138A (en) * 1996-11-15 1998-06-02 Citizen Electron Co Ltd Side-use electronic component provided with lower electrode
DE4242842C2 (en) * 1992-02-14 1999-11-04 Sharp Kk Light-emitting component for surface mounting and method for its production
US6949771B2 (en) * 2001-04-25 2005-09-27 Agilent Technologies, Inc. Light source
US7863639B2 (en) * 2006-04-12 2011-01-04 Semileds Optoelectronics Co. Ltd. Light-emitting diode lamp with low thermal resistance
US8373195B2 (en) 2006-04-12 2013-02-12 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500880A (en) * 1981-07-16 1983-05-26 “エルコズ”エレクトロエク　コンサルティング　サ−ビスィズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング optoelectronic components
JPS6367272U (en) * 1981-07-16 1988-05-06
JPS599564U (en) * 1982-07-09 1984-01-21 清水　亮太郎 leadless light emitting diode
JPS60109344U (en) * 1983-12-26 1985-07-25 日本ビクター株式会社 chipped semiconductor device
JPH0258356U (en) * 1988-10-21 1990-04-26
JPH0267664U (en) * 1988-11-11 1990-05-22
JPH058960U (en) * 1991-07-15 1993-02-05 スタンレー電気株式会社 Surface mount LED
DE4242842C2 (en) * 1992-02-14 1999-11-04 Sharp Kk Light-emitting component for surface mounting and method for its production
JPH10150138A (en) * 1996-11-15 1998-06-02 Citizen Electron Co Ltd Side-use electronic component provided with lower electrode
US6949771B2 (en) * 2001-04-25 2005-09-27 Agilent Technologies, Inc. Light source
US7863639B2 (en) * 2006-04-12 2011-01-04 Semileds Optoelectronics Co. Ltd. Light-emitting diode lamp with low thermal resistance
US8101966B2 (en) 2006-04-12 2012-01-24 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance
US8373195B2 (en) 2006-04-12 2013-02-12 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance

Also Published As

Publication number Publication date
JPS6043040B2 (en) 1985-09-26

Similar Documents

Publication Publication Date Title
JPS55107283A (en) Luminous diode
JPS52143785A (en) Semiconductor device
JPS5643816A (en) Structure of bonding pad part
JPS5651851A (en) Semiconductor device
JPS5314557A (en) Electrode structure in semiconductor device
JPS55165661A (en) Semiconductor device
JPS5740986A (en) Light-emitting element
JPS5226164A (en) Semi-conductor unit
JPS5623768A (en) Semiconductor device
JPS57210639A (en) Semiconductor device
JPS5745938A (en) Semiconductor device
JPS5456780A (en) Manufacture of light emitting device
JPS5280780A (en) Semiconductor device
JPS5335379A (en) Bump type semiconductor device
JPS5368975A (en) Semiconductor element
JPS5610950A (en) Lead wire for semiconductor device
JPS5354469A (en) Semiconductor integrated circuit
JPS5399765A (en) Semiconductor device having bonding pad
JPS56105670A (en) Semiconductor device
JPS5368970A (en) Solder electrode structure
JPS5743446A (en) Manufacture of ic package
JPS56100448A (en) Semiconductor memory element
JPS55138860A (en) Semiconductor device
JPS6448393A (en) Thin film el display element and manufacture thereof
JPS53117970A (en) Resin seal type semiconductor device