JPH0267664U

JPH0267664U -

Info

Publication number: JPH0267664U
Application number: JP14657788U
Authority: JP
Priority date: 1988-11-11
Filing date: 1988-11-11
Publication date: 1990-05-22

Description

[Brief explanation of drawings]

第１図は本考案によるＳＭＴ半導体装置の一実
施例を示し、Ａは平面図、Ｂは断面図、Ｃは右側
面図である。第２図は従来のＳＭＴ半導体装置の
一例を示すもので、Ａは平面図、Ｂは断面図、Ｃ
は右側面図である。１０…ＳＭＴ半導体装置；１１…基板；１１ａ
…凹状の反射面；１２…アノード；１３…カソー
ド；１４…半導体素子チツプ；１５…外側形状；
１５ａ…レンズ部。 FIG. 1 shows an embodiment of the SMT semiconductor device according to the present invention, in which A is a plan view, B is a sectional view, and C is a right side view. Figure 2 shows an example of a conventional SMT semiconductor device, where A is a plan view, B is a cross-sectional view, and C is a cross-sectional view.
is a right side view. 10...SMT semiconductor device; 11...substrate; 11a
...Concave reflective surface; 12...Anode; 13...Cathode; 14...Semiconductor element chip; 15...Outer shape;
15a...Lens section.

Claims

[Scope of utility model registration request]

In a surface-mounted semiconductor device in which a semiconductor chip is mounted on a substrate with double-sided through holes,
A surface-mounted semiconductor device characterized in that a concave reflective surface is formed in a region on the upper surface of the substrate where the chip of the semiconductor element is attached, and the chip of the semiconductor element is attached to the bottom of the reflective surface.