JPH05114751A - Optical semiconductor device - Google Patents
Optical semiconductor deviceInfo
- Publication number
- JPH05114751A JPH05114751A JP3275108A JP27510891A JPH05114751A JP H05114751 A JPH05114751 A JP H05114751A JP 3275108 A JP3275108 A JP 3275108A JP 27510891 A JP27510891 A JP 27510891A JP H05114751 A JPH05114751 A JP H05114751A
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- wiring board
- printed wiring
- display device
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光半導体装置に関し、
特に１つの製品で数種類の実装方法に対応できる光半導
体装置に係る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device,
In particular, the present invention relates to an optical semiconductor device capable of supporting several types of mounting methods with one product.
【０００２】[0002]
【従来の技術】従来の光半導体装置（ＬＥＤ表示装置）
として、例えば図４，５に示すものがある。このＬＥＤ
表示装置は、図４，５に示すように、一方の電極端子の
一端に銀ペーストａでＬＥＤチップｂを接着し、このＬ
ＥＤチップｂと他方の電極の一端との間に金線等のボン
ディングワイヤーｃを配線して透明性を有する合成樹脂
ｄで封止している。なお、図中、７はプリント配線基
板、９は半田である。2. Description of the Related Art A conventional optical semiconductor device (LED display device)
For example, there are those shown in FIGS. This LED
As shown in FIGS. 4 and 5, in the display device, an LED chip b is bonded to one end of one electrode terminal with silver paste a,
A bonding wire c such as a gold wire is wired between the ED chip b and one end of the other electrode, and is sealed with a synthetic resin d having transparency. In the figure, 7 is a printed wiring board and 9 is solder.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記Ｌ
ＥＤ表示装置は、１つの製品においては１方向の発光し
か使用できない。すなわち、図４のＬＥＤ表示装置は天
面発光用、図５のＬＥＤ表示装置は側面発光用としてし
か使用できず、その使用用途は限定されている。However, the above L
The ED display device can use light emission in only one direction in one product. That is, the LED display device of FIG. 4 can be used only for top-face light emission, and the LED display device of FIG. 5 can be used only for side face light emission, and its use is limited.
【０００４】本発明は、上記に鑑み、プリント配線基板
に対して縦置きもしくは横置きで実装することが可能
で、１つの製品での使用用途を拡大することができる光
半導体装置の提供を目的とする。In view of the above, the present invention has an object to provide an optical semiconductor device which can be mounted vertically or horizontally on a printed wiring board and can be used in a single product. And
【０００５】[0005]
【課題を解決するための手段】本発明による課題解決手
段は、図１ないし図３の如く、装置本体２に光半導体素
子４が搭載される搭載用凹部２１が設けられ、該搭載用
凹部２１から両側に電極端子３Ａ，３Ｂがプリント配線
基板７に対して縦置きもしくは横置きにして実装可能と
なるよう発光部以外に立体的にめっき配線され、一側の
電極端子３Ａに光半導体素子４がダイボンドされ、他側
の電極端子３Ｂと光半導体素子４がボンディングワイヤ
ー６を介して結線され、前記光半導体素子４が透光性樹
脂にて封止されたものである。As shown in FIGS. 1 to 3, in the means for solving the problems according to the present invention, a mounting recess 21 for mounting an optical semiconductor element 4 is provided in a device body 2, and the mounting recess 21 is provided. From the light emitting portion so that the electrode terminals 3A and 3B can be mounted vertically or horizontally on the printed wiring board 7 on both sides, and the optical semiconductor element 4 is connected to the electrode terminal 3A on one side. Is die-bonded, the electrode terminal 3B on the other side and the optical semiconductor element 4 are connected via a bonding wire 6, and the optical semiconductor element 4 is sealed with a translucent resin.
【０００６】[0006]
【作用】上記課題解決手段において、両電極端子３Ａ，
３Ｂが搭載用凹部２１から両側にプリント配線基板７に
対して縦置きもしくは横置きにして実装可能となるよう
立体的にめっき配線することにより、必要に応じて両電
極端子３Ａ，３Ｂの一部をプリント配線基板７の配線部
に接続するだけで、プリント配線基板７に対して縦置き
もしくは横置きで実装することができ、１つの製品の使
用用途が拡大される。In the above means for solving the problem, both electrode terminals 3A,
Part of both electrode terminals 3A and 3B is formed by three-dimensionally plating wiring so that 3B can be mounted vertically or horizontally on the printed wiring board 7 from both sides of the mounting recess 21. Can be mounted vertically or horizontally on the printed wiring board 7 simply by connecting the wiring section to the wiring portion of the printed wiring board 7, and the application of one product is expanded.
【０００７】[0007]
【実施例】図１は本発明の一実施例に係る樹脂封止前の
ＬＥＤ発光表示装置の斜視図、図２はＬＥＤ発光表示装
置を横置きにしてプリント配線基板上に実装した状態を
示す斜視図、図３はＬＥＤ発光表示装置を縦置きにして
プリント配線基板上に実装した状態を示す斜視図であ
る。FIG. 1 is a perspective view of an LED light emitting display device before resin sealing according to an embodiment of the present invention, and FIG. 2 shows a state in which the LED light emitting display device is mounted horizontally and mounted on a printed wiring board. FIG. 3 is a perspective view showing a state in which the LED light emitting display device is vertically placed and mounted on a printed wiring board.
【０００８】図において、１はマルチ実装タイプのＬＥ
Ｄ表示装置、２は遮光性かつ反射性を有する合成樹脂
（液晶ポリマー）からなる装置本体で、１枚の基板に多
数個連続的に形成したものを、ダイシングソーにて切断
して、十字形の装置本体２を得る。したがって、装置本
体２の４方向に突出する突出部の先端２ａは、切断面で
ある。また、隣り合う突出部間の切欠部２ｂはスルーホ
ールの１／４の形状を示すものであり、後述のように、
めっきが施される。また、この本体２の表面中央部に
は、ＬＥＤチップ４が搭載される搭載用凹部２１が形成
されている。In the figure, 1 is a multi-mounting type LE.
D display device, 2 is a device main body made of a synthetic resin (liquid crystal polymer) having a light-shielding property and a reflective property, and a large number of those continuously formed on one substrate are cut with a dicing saw to form a cross shape. The device main body 2 is obtained. Therefore, the tip 2a of the protruding portion that protrudes in four directions of the device body 2 is a cut surface. Further, the notch 2b between the adjacent protrusions has a shape of a quarter of the through hole, and as described later,
Plated. In addition, a mounting recess 21 for mounting the LED chip 4 is formed in the center of the surface of the main body 2.
【０００９】また、装置本体２には、図１の如く、その
側面２２から上面２３を経て凹部２１の側壁２１１へ、
さらに凹部２１の側壁２１１から底面２１２のほぼ中央
に至る箇所まで両電極端子３Ａ，３Ｂがめっき配線され
ている。すなわち、図２，３のように、搭載用凹部２１
から両側に電極端子３Ａ，３Ｂがプリント配線基板７に
対して縦置き（側面発光）もしくは横置き（天面発光）
にして実装可能となるよう立体的にめっき配線されてい
る（図１中、斜線部はめっき配線部を示す）。Further, in the apparatus main body 2, as shown in FIG. 1, from the side surface 22 to the upper surface 23 to the side wall 211 of the concave portion 21,
Further, both electrode terminals 3A and 3B are plated and wired from the side wall 211 of the concave portion 21 to a position almost at the center of the bottom surface 212. That is, as shown in FIGS.
The electrode terminals 3A and 3B are placed vertically (side light emission) or horizontally (top light emission) on both sides of the printed wiring board 7.
The wiring is plated three-dimensionally so that it can be mounted (in FIG. 1, the hatched portion indicates the plated wiring portion).
【００１０】そして、一側の電極端子３Ａの凹部２１側
の一端３１Ａには、ＬＥＤチップ４が銀ペースト５を介
してダイボンドされている。さらに、このＬＥＤチップ
４と他側の電極端子３Ｂの凹部２１側の一端３１Ｂとが
金線等のボンディングワイヤー６を介して結線されてい
る。Then, the LED chip 4 is die-bonded to the one end 31A of the electrode terminal 3A on one side on the concave portion 21 side through the silver paste 5. Further, the LED chip 4 and one end 31B of the other side electrode terminal 3B on the concave portion 21 side are connected via a bonding wire 6 such as a gold wire.
【００１１】また、ＬＥＤチップ４はダイボンド、ワイ
ヤーボンドが施された後、図２，３に示すように、透光
性樹脂８にて封止されている。なお、図中、９は半田で
ある。The LED chip 4 is die-bonded and wire-bonded and then sealed with a translucent resin 8 as shown in FIGS. In the figure, 9 is solder.
【００１２】上記ＬＥＤ発光表示装置は、以下のように
してプリント配線基板７に実装される。The LED light emitting display device is mounted on the printed wiring board 7 as follows.
【００１３】ＬＥＤ発光表示装置を横置きにしてプリン
ト配線基板７に実装する場合には、ＬＥＤ発光表示装置
１をプリント配線基板７上に横置きした後、両電極端子
３Ａ，３Ｂの他端３２Ａ，３２Ｂをプリント配線基板７
のめっき配線部７Ａ，７Ｂに夫々半田付けによって接続
する。そうすると、ＬＥＤ発光表示装置１を天面発光用
として使用することができる（図２参照）。When the LED light emitting display device is mounted horizontally on the printed wiring board 7, the LED light emitting display device 1 is mounted horizontally on the printed wiring board 7 and then the other ends 32A of the two electrode terminals 3A and 3B. , 32B to the printed wiring board 7
Are connected to the plated wiring portions 7A and 7B by soldering. Then, the LED light emitting display device 1 can be used for top surface light emission (see FIG. 2).
【００１４】一方、ＬＥＤ発光表示装置を縦置きにして
プリント配線基板７に実装する場合には、両電極端子３
Ａ，３Ｂを左右方向としてＬＥＤ発光表示装置１を縦置
きした後、両電極端子３Ａ，３Ｂの他端３２Ａ，３２Ｂ
をプリント配線基板７のめっき配線部７Ａ，７Ｂに夫々
半田付けによって接続する。そうすると、ＬＥＤ発光表
示装置１を側面発光用に使用することができる（図３参
照）。On the other hand, when the LED light emitting display device is mounted vertically on the printed wiring board 7, both electrode terminals 3 are used.
After vertically arranging the LED light emitting display device 1 with A and 3B in the left and right direction, the other ends 32A and 32B of the electrode terminals 3A and 3B are arranged.
Are connected to the plated wiring portions 7A and 7B of the printed wiring board 7 by soldering. Then, the LED light emitting display device 1 can be used for side surface light emission (see FIG. 3).
【００１５】このようにして、マルチにめっき配線され
た両電極端子３Ａ，３Ｂを利用し、両電極端子３Ａ，３
Ｂをプリント配線基板７の表面のめっき配線部７Ａ，７
Ｂに実装することができるから、必要に応じて装置をプ
リント配線基板７に対して縦置きもしくは横置きで実装
することが可能となり、天面発光および側面発光にも使
用することができ、よって２方向に光を供給することが
できる。In this way, by utilizing the electrode terminals 3A, 3B which are multi-plated and wired, the electrode terminals 3A, 3B are
B is the plated wiring portion 7A, 7 on the surface of the printed wiring board 7.
Since it can be mounted on B, the device can be mounted vertically or horizontally on the printed wiring board 7 as required, and can also be used for top emission and side emission. Light can be supplied in two directions.
【００１６】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.
【００１７】上記実施例において、ＬＥＤチップを数
個、または発光色の異なるＬＥＤチップを数種類ボンデ
ィングすることにより、高輝度化および多色化も可能と
なる。In the above-mentioned embodiment, by bonding several LED chips or several kinds of LED chips having different emission colors, it is possible to realize high brightness and multicolor.
【００１８】また、発光部以外の全角をめっき配線する
ことにより、その実装方法はよりマルチ化する。Further, the mounting method is made more multi-layered by plating and wiring the whole area except the light emitting portion.
【００１９】さらに、本発明は、ＬＥＤ発光表示装置に
マルチ化だけではなく、受光装置のマルチ化にも適用し
得る。Furthermore, the present invention can be applied not only to the LED light emitting display device, but also to the light receiving device.
【００２０】[0020]
【発明の効果】以上の説明から明らかな通り、本発明に
よると、プリント配線基板に対して縦置きもしくは横置
きにして実装可能となるよう発光部以外に立体的にめっ
き配線して成る両電極端子を利用することで、必要に応
じて光半導体装置をプリント配線板に対して数種類の実
装方法に対応することができるから、１つの製品の使用
用途が拡大される。As is apparent from the above description, according to the present invention, both electrodes are formed by three-dimensionally plated wiring other than the light emitting portion so that the printed wiring board can be mounted vertically or horizontally. By using the terminals, the optical semiconductor device can be applied to several types of mounting methods on the printed wiring board as needed, so that the usage of one product is expanded.
【００２１】よって、装置自体の設計および製造仕様の
簡略化を図ることができる。Therefore, it is possible to simplify the design and manufacturing specifications of the device itself.
【図１】図１は本発明の一実施例に係る樹脂封止前のＬ
ＥＤ表示装置の斜視図である。FIG. 1 shows L before resin sealing according to an embodiment of the present invention.
It is a perspective view of an ED display device.
【図２】図２はＬＥＤ発光装置を横置きにしてプリント
配線基板上に実装した状態を示す斜視図である。FIG. 2 is a perspective view showing a state in which the LED light emitting device is placed horizontally and mounted on a printed wiring board.
【図３】図３はＬＥＤ発光表示装置を縦置きにしてプリ
ント配線基板上に実装した状態を示す斜視図である。FIG. 3 is a perspective view showing a state in which the LED light emitting display device is vertically placed and mounted on a printed wiring board.
【図４】図４は従来の天面発光用のＬＥＤ表示装置を示
す図である。FIG. 4 is a diagram showing a conventional LED display device for ceiling light emission.
【図５】図５は従来の側面発光用のＬＥＤ表示装置を示
す図である。FIG. 5 is a view showing a conventional LED display device for side surface light emission.
２ 装置本体 ４ ＬＥＤチップ ６ ボンディングワイヤー ７ プリント配線基板 ２１ 搭載用凹部 ３Ａ，３Ｂ 電極端子 2 Device body 4 LED chip 6 Bonding wire 7 Printed wiring board 21 Mounting recess 3A, 3B Electrode terminal
Claims (1)
る光半導体装置であって、装置本体に光半導体素子が搭
載される搭載用凹部が設けられ、該搭載用凹部から両側
に電極端子がプリント配線基板に対して縦置きもしくは
横置きにして実装可能となるよう発光部以外に立体的に
めっき配線され、一側の電極端子に光半導体素子がダイ
ボンドされ、他側の電極端子と光半導体素子がボンディ
ングワイヤーを介して結線され、前記光半導体素子が透
光性樹脂にて封止されたことを特徴とする光半導体装
置。1. An optical semiconductor device mounted on a printed wiring board for use, wherein a mounting recess for mounting an optical semiconductor element is provided in a main body of the device, and electrode terminals are provided on both sides of the mounting recess. Three-dimensionally plated wiring other than the light emitting part so that it can be mounted vertically or horizontally on the printed wiring board, the optical semiconductor element is die-bonded to the electrode terminal on one side, and the electrode terminal on the other side and the optical semiconductor. An optical semiconductor device, wherein the elements are connected via a bonding wire, and the optical semiconductor element is sealed with a translucent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3275108A JPH05114751A (en) | 1991-10-23 | 1991-10-23 | Optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3275108A JPH05114751A (en) | 1991-10-23 | 1991-10-23 | Optical semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05114751A true JPH05114751A (en) | 1993-05-07 |
Family
ID=17550855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3275108A Pending JPH05114751A (en) | 1991-10-23 | 1991-10-23 | Optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05114751A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1189291A2 (en) * | 2000-09-13 | 2002-03-20 | Citizen Electronics Co., Ltd. | Chip type light emitting diode and method of manufacture thereof |
| JP2008147605A (en) * | 2006-11-14 | 2008-06-26 | Harison Toshiba Lighting Corp | Light-emitting device, method of manufacturing the same and mounting board |
| EP2483939A1 (en) * | 2009-10-01 | 2012-08-08 | Excelitas Canada Inc. | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation |
| US8791492B2 (en) | 2009-10-01 | 2014-07-29 | Excelitas Canada, Inc. | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same |
| US9018074B2 (en) | 2009-10-01 | 2015-04-28 | Excelitas Canada, Inc. | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same |
| JP2015149448A (en) * | 2014-02-07 | 2015-08-20 | ローム株式会社 | Light emitting module, light emitting device and method of manufacturing light emitting module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63165685U (en) * | 1987-04-17 | 1988-10-28 | ||
| JPH01163352U (en) * | 1988-04-30 | 1989-11-14 | ||
| JPH0258356U (en) * | 1988-10-21 | 1990-04-26 | ||
| JPH0267664U (en) * | 1988-11-11 | 1990-05-22 | ||
| JPH0463163U (en) * | 1990-10-04 | 1992-05-29 | ||
| JPH0465465U (en) * | 1990-10-18 | 1992-06-08 |
-
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63165685U (en) * | 1987-04-17 | 1988-10-28 | ||
| JPH01163352U (en) * | 1988-04-30 | 1989-11-14 | ||
| JPH0258356U (en) * | 1988-10-21 | 1990-04-26 | ||
| JPH0267664U (en) * | 1988-11-11 | 1990-05-22 | ||
| JPH0463163U (en) * | 1990-10-04 | 1992-05-29 | ||
| JPH0465465U (en) * | 1990-10-18 | 1992-06-08 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1189291A2 (en) * | 2000-09-13 | 2002-03-20 | Citizen Electronics Co., Ltd. | Chip type light emitting diode and method of manufacture thereof |
| EP1189291A3 (en) * | 2000-09-13 | 2006-03-22 | Citizen Electronics Co., Ltd. | Chip type light emitting diode and method of manufacture thereof |
| JP2008147605A (en) * | 2006-11-14 | 2008-06-26 | Harison Toshiba Lighting Corp | Light-emitting device, method of manufacturing the same and mounting board |
| EP2483939A1 (en) * | 2009-10-01 | 2012-08-08 | Excelitas Canada Inc. | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation |
| JP2013506985A (en) * | 2009-10-01 | 2013-02-28 | エクセリタス カナダ，インコーポレイテッド | Optoelectronic device with laminate-less carrier packaging in landscape or upside-down device arrangement |
| US8791492B2 (en) | 2009-10-01 | 2014-07-29 | Excelitas Canada, Inc. | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same |
| US9018074B2 (en) | 2009-10-01 | 2015-04-28 | Excelitas Canada, Inc. | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same |
| JP2015149448A (en) * | 2014-02-07 | 2015-08-20 | ローム株式会社 | Light emitting module, light emitting device and method of manufacturing light emitting module |
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