JPH01163352U - - Google Patents

Info

Publication number
JPH01163352U
JPH01163352U JP1988059123U JP5912388U JPH01163352U JP H01163352 U JPH01163352 U JP H01163352U JP 1988059123 U JP1988059123 U JP 1988059123U JP 5912388 U JP5912388 U JP 5912388U JP H01163352 U JPH01163352 U JP H01163352U
Authority
JP
Japan
Prior art keywords
emitting diode
chip
type light
light
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988059123U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988059123U priority Critical patent/JPH01163352U/ja
Publication of JPH01163352U publication Critical patent/JPH01163352U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例に係るチツプ型ＬＥ
Ｄを示す斜視図、第２図は第１図に示すチツプ型
ＬＥＤを実装用基板に実装した状態を示す斜視図
である。 １……絶縁基板、２，３……電極、４……スル
ーホール電極、５……ＬＥＤ素子、６……ワイヤ
ー、７……レンズ部、８……実装用基板、９……
半田。 FIG. 1 shows a chip type LE according to an embodiment of the present invention.
FIG. 2 is a perspective view showing the chip type LED shown in FIG. 1 mounted on a mounting board. 1... Insulating substrate, 2, 3... Electrode, 4... Through-hole electrode, 5... LED element, 6... Wire, 7... Lens section, 8... Mounting board, 9...
solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に一対の電極を形成し、発光ダイオ
ード素子を実装したチツプ型発光ダイオードにお
いて、絶縁基板の四角にスルーホール電極を形成
し、総厚を幅寸法と同等若しくはそれ以上に大き
くし、実装用基板に対し平行に発光するように半
田付けを可能にしたことを特徴とするチツプ型発
光ダイオード。 In a chip-type light-emitting diode in which a pair of electrodes are formed on an insulating substrate and a light-emitting diode element is mounted, through-hole electrodes are formed in the squares of the insulating substrate, the total thickness is made equal to or larger than the width dimension, and the chip type light-emitting diode is mounted. A chip-type light emitting diode characterized in that it can be soldered so that it emits light parallel to a substrate.
JP1988059123U 1988-04-30 1988-04-30 Pending JPH01163352U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988059123U JPH01163352U (en) 1988-04-30 1988-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988059123U JPH01163352U (en) 1988-04-30 1988-04-30

Publications (1)

Publication Number Publication Date
JPH01163352U true JPH01163352U (en) 1989-11-14

Family

ID=31284910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988059123U Pending JPH01163352U (en) 1988-04-30 1988-04-30

Country Status (1)

Country Link
JP (1) JPH01163352U (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (en) * 1991-10-23 1993-05-07 Sharp Corp Optical semiconductor device
JPH05218507A (en) * 1992-02-05 1993-08-27 Sanyo Electric Co Ltd Optical semiconductor device
JPH07115227A (en) * 1993-10-15 1995-05-02 Rohm Co Ltd Light emitting device and light emitting unit using the same
JPH07131072A (en) * 1993-10-29 1995-05-19 Rohm Co Ltd Surface-mount type side face light emitting equipment, light emitting device using it, and liquid crystal display using light emitting device
JPH08306261A (en) * 1995-04-28 1996-11-22 Shichizun Denshi:Kk Surface mount intermittent operation switch and its manufacture
JPH0936432A (en) * 1995-07-17 1997-02-07 Sharp Corp Lateral emission led and manufacture thereof
JPH09181359A (en) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk Chip light emitting diode
JPH10150138A (en) * 1996-11-15 1998-06-02 Citizen Electron Co Ltd Side-use electronic component provided with lower electrode
JPH10290029A (en) * 1997-04-14 1998-10-27 Rohm Co Ltd Led chip component
JP2000196000A (en) * 1998-12-25 2000-07-14 Rohm Co Ltd Chip electronic component and its manufacture
JP2001160630A (en) * 1999-12-03 2001-06-12 Rohm Co Ltd Chip type semiconductor device
JP2006190764A (en) * 2005-01-05 2006-07-20 Stanley Electric Co Ltd Surface mounting led
JP2013105784A (en) * 2011-11-10 2013-05-30 Seiko Instruments Inc Optical sensor device and method for manufacturing the same
JP2019054248A (en) * 2018-09-19 2019-04-04 日亜化学工業株式会社 Light-emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624157B2 (en) * 1984-10-30 1987-01-28 Sanyo Electric Co
JPS6210456B2 (en) * 1980-12-10 1987-03-06 Sanyo Denki Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210456B2 (en) * 1980-12-10 1987-03-06 Sanyo Denki Kk
JPS624157B2 (en) * 1984-10-30 1987-01-28 Sanyo Electric Co

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (en) * 1991-10-23 1993-05-07 Sharp Corp Optical semiconductor device
JPH05218507A (en) * 1992-02-05 1993-08-27 Sanyo Electric Co Ltd Optical semiconductor device
JPH07115227A (en) * 1993-10-15 1995-05-02 Rohm Co Ltd Light emitting device and light emitting unit using the same
JPH07131072A (en) * 1993-10-29 1995-05-19 Rohm Co Ltd Surface-mount type side face light emitting equipment, light emitting device using it, and liquid crystal display using light emitting device
JPH08306261A (en) * 1995-04-28 1996-11-22 Shichizun Denshi:Kk Surface mount intermittent operation switch and its manufacture
JPH0936432A (en) * 1995-07-17 1997-02-07 Sharp Corp Lateral emission led and manufacture thereof
JPH09181359A (en) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk Chip light emitting diode
JPH10150138A (en) * 1996-11-15 1998-06-02 Citizen Electron Co Ltd Side-use electronic component provided with lower electrode
JPH10290029A (en) * 1997-04-14 1998-10-27 Rohm Co Ltd Led chip component
JP2000196000A (en) * 1998-12-25 2000-07-14 Rohm Co Ltd Chip electronic component and its manufacture
JP2001160630A (en) * 1999-12-03 2001-06-12 Rohm Co Ltd Chip type semiconductor device
JP2006190764A (en) * 2005-01-05 2006-07-20 Stanley Electric Co Ltd Surface mounting led
JP2013105784A (en) * 2011-11-10 2013-05-30 Seiko Instruments Inc Optical sensor device and method for manufacturing the same
JP2019054248A (en) * 2018-09-19 2019-04-04 日亜化学工業株式会社 Light-emitting device

Similar Documents

Publication Publication Date Title
JPH01163352U (en)
JPH0465465U (en)
JPS6113958U (en) light emitting diode lamp
JPH01171055U (en)
JPS63191647U (en)
JPS61140563U (en)
JPH0477269U (en)
JPS648759U (en)
JPH0351869U (en)
JPS6284944U (en)
JPS62112165U (en)
JPH0323943U (en)
JPS60185351U (en) Chip type light emitting diode
JPH0459416U (en)
JPS61171089U (en)
JPH0339783U (en)
JPH0217854U (en)
JPH01155665U (en)
JPS63127248U (en)
JPS6429673U (en)
JPS62168663U (en)
JPH01173954U (en)
JPS645460U (en)
JPH01153658U (en)
JPH01179460U (en)