JPH0477269U - - Google Patents

Info

Publication number
JPH0477269U
JPH0477269U JP12029990U JP12029990U JPH0477269U JP H0477269 U JPH0477269 U JP H0477269U JP 12029990 U JP12029990 U JP 12029990U JP 12029990 U JP12029990 U JP 12029990U JP H0477269 U JPH0477269 U JP H0477269U
Authority
JP
Japan
Prior art keywords
insulating substrate
main surface
light emitting
wiring conductor
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12029990U
Other languages
Japanese (ja)
Other versions
JP2525554Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990120299U priority Critical patent/JP2525554Y2/en
Publication of JPH0477269U publication Critical patent/JPH0477269U/ja
Application granted granted Critical
Publication of JP2525554Y2 publication Critical patent/JP2525554Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による発光表示装置の一実施例
を示す第２図の−線に沿う断面図、第２図は
回路基板に実装した発光表示装置の正面図、第３
図はスルーホールの中心に沿う断面図、第４図は
第２図の−線に沿う断面図である。 ２１……絶縁性基板、２２……発光ダイオード
チツプ（発光素子）、２５，２６……外部リード
、２７，２８……スルーホール（孔）、２９……
凹部、３０，３１，３２，３３……側壁面、３４
……底面、３５，３６……配線導体、３７，３８
……溝部、３９，４０……導体層。 1 is a sectional view taken along the - line in FIG. 2 showing an embodiment of the light emitting display device according to the present invention; FIG. 2 is a front view of the light emitting display device mounted on a circuit board;
The figure is a sectional view taken along the center of the through hole, and FIG. 4 is a sectional view taken along the - line in FIG. 2. 21... Insulating substrate, 22... Light emitting diode chip (light emitting element), 25, 26... External lead, 27, 28... Through hole (hole), 29...
Recessed portion, 30, 31, 32, 33...Side wall surface, 34
... Bottom surface, 35, 36 ... Wiring conductor, 37, 38
...Groove portion, 39, 40...Conductor layer.

Claims (1)

【実用新案登録請求の範囲】 絶縁性基板の一方の主面に形成された凹部の底
面と側壁面に光反射性の配線導体が配設され、前
記凹部内の前記配線導体に発光素子が載置された
発光表示装置において、 前記絶縁性基板の他方の主面に形成された溝部
に収容された一方の端部及び前記絶縁性基板の外
側に導出された他方の端部を有する外部リードを
備え、前記絶縁性基板に前記一方の主面から他方
の主面に向つて配設された孔又は切欠部の壁面に
形成された導体層を介して前記配線導体が前記外
部リードに電気的に接続されていることを特徴と
する発光表示装置。[Claims for Utility Model Registration] A light-reflective wiring conductor is provided on the bottom and side wall surfaces of a recess formed on one main surface of an insulating substrate, and a light emitting element is mounted on the wiring conductor in the recess. In the light emitting display device, an external lead having one end accommodated in a groove formed on the other main surface of the insulating substrate and the other end led out to the outside of the insulating substrate is provided. The wiring conductor is electrically connected to the external lead through a conductor layer formed on a wall surface of a hole or notch provided in the insulating substrate from the one main surface to the other main surface. A light emitting display device characterized in that:
JP1990120299U 1990-11-19 1990-11-19 Light emitting display Expired - Lifetime JP2525554Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990120299U JP2525554Y2 (en) 1990-11-19 1990-11-19 Light emitting display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990120299U JP2525554Y2 (en) 1990-11-19 1990-11-19 Light emitting display

Publications (2)

Publication Number Publication Date
JPH0477269U true JPH0477269U (en) 1992-07-06
JP2525554Y2 JP2525554Y2 (en) 1997-02-12

Family

ID=31868212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990120299U Expired - Lifetime JP2525554Y2 (en) 1990-11-19 1990-11-19 Light emitting display

Country Status (1)

Country Link
JP (1) JP2525554Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229603A (en) * 2002-01-31 2003-08-15 Citizen Electronics Co Ltd Double-sided emitting led package
JP2005277380A (en) * 2004-02-23 2005-10-06 Stanley Electric Co Ltd Led and its manufacturing method
JP2008016593A (en) * 2006-07-05 2008-01-24 Ngk Spark Plug Co Ltd Wiring board for mounting light emitting element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827767U (en) * 1971-08-05 1973-04-04
JPS58159583U (en) * 1982-04-20 1983-10-24 三洋電機株式会社 light emitting diode display
JPH01283883A (en) * 1988-05-10 1989-11-15 Matsushita Electric Ind Co Ltd Light emitting diode and forming method for its electrode

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827767U (en) * 1971-08-05 1973-04-04
JPS58159583U (en) * 1982-04-20 1983-10-24 三洋電機株式会社 light emitting diode display
JPH01283883A (en) * 1988-05-10 1989-11-15 Matsushita Electric Ind Co Ltd Light emitting diode and forming method for its electrode

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229603A (en) * 2002-01-31 2003-08-15 Citizen Electronics Co Ltd Double-sided emitting led package
JP2005277380A (en) * 2004-02-23 2005-10-06 Stanley Electric Co Ltd Led and its manufacturing method
JP4572312B2 (en) * 2004-02-23 2010-11-04 スタンレー電気株式会社 LED and manufacturing method thereof
JP2008016593A (en) * 2006-07-05 2008-01-24 Ngk Spark Plug Co Ltd Wiring board for mounting light emitting element

Also Published As

Publication number Publication date
JP2525554Y2 (en) 1997-02-12

Similar Documents

Publication Publication Date Title
JPH01163352U (en)
JPH0477269U (en)
JPH0463661U (en)
JPS6113958U (en) light emitting diode lamp
JPH0465465U (en)
JPS63191647U (en)
JPH01171055U (en)
JPS63132476U (en)
JPH0485749U (en)
JPH0217854U (en)
JPS6230489U (en)
JPH0254246U (en)
JPS63167782U (en)
JPS6413167U (en)
JPS61140563U (en)
JPS645460U (en)
JPS58150223U (en) Illuminated display circuit unit
JPS63188593U (en)
JPH0345649U (en)
JPS6357759U (en)
JPS61201383U (en)
JPH01155665U (en)
JPH0350340U (en)
JPH0166763U (en)
JPS642446U (en)