JPH0350340U - - Google Patents
Info
- Publication number
- JPH0350340U JPH0350340U JP11220089U JP11220089U JPH0350340U JP H0350340 U JPH0350340 U JP H0350340U JP 11220089 U JP11220089 U JP 11220089U JP 11220089 U JP11220089 U JP 11220089U JP H0350340 U JPH0350340 U JP H0350340U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor element
- lead
- dissipation structure
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
Description
第１図は本考案にかかる放熱構造を示す断面図
、第２図は本考案にかかる放熱構造の分解斜視図
、第３図ａ，ｂは従来の放熱構造を示す断面図で
ある。
図において、１……回路基板、２……半導体素
子、３，６，７……ヒートシンク、４……半導体
素子から導出した外部リード、５……回路基板内
部の配線層、８……ヒートシンクから導出したリ
ード、９……回路基板内部の信号線層、１０……
回路基板内部の接地層を示している。
FIG. 1 is a sectional view showing a heat dissipation structure according to the present invention, FIG. 2 is an exploded perspective view of the heat dissipation structure according to the present invention, and FIGS. 3A and 3B are sectional views showing a conventional heat dissipation structure. In the figure, 1...Circuit board, 2...Semiconductor element, 3, 6, 7...Heat sink, 4...External lead led from the semiconductor element, 5...Wiring layer inside the circuit board, 8...From the heat sink Derived leads, 9...Signal line layer inside the circuit board, 10...
Shows the ground layer inside the circuit board.
Claims (1)
体素子に熱的に接続されたヒートシンク７からリ
ード８が導出されて、該リードが回路基板の接地
層１０に接続されていることを特徴とする半導体
素子の放熱構造。 A semiconductor element 2 is mounted on a circuit board 1, and a lead 8 is led out from a heat sink 7 that is thermally connected to the semiconductor element, and the lead is connected to a ground layer 10 of the circuit board. Heat dissipation structure for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220089U JPH0350340U (en) | 1989-09-25 | 1989-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220089U JPH0350340U (en) | 1989-09-25 | 1989-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350340U true JPH0350340U (en) | 1991-05-16 |
Family
ID=31660648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11220089U Pending JPH0350340U (en) | 1989-09-25 | 1989-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350340U (en) |
-
1989
- 1989-09-25 JP JP11220089U patent/JPH0350340U/ja active Pending