JPS62131449U - - Google Patents

Info

Publication number
JPS62131449U
JPS62131449U JP1986019667U JP1966786U JPS62131449U JP S62131449 U JPS62131449 U JP S62131449U JP 1986019667 U JP1986019667 U JP 1986019667U JP 1966786 U JP1966786 U JP 1966786U JP S62131449 U JPS62131449 U JP S62131449U
Authority
JP
Japan
Prior art keywords
island
chip
heat radiation
package
radiation hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986019667U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986019667U priority Critical patent/JPS62131449U/ja
Publication of JPS62131449U publication Critical patent/JPS62131449U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第４図は、この考案の実施態様を例
示し、第１図は、電子素子の横断面図、第２図は
同底面図、第３図は、放熱板を取付けた同横断面
図、第４図は、放熱フインを取付けた同横断面図
、第５図は、従来の電子素子を示す横断面図であ
る。 １：電子素子、２：プリント基板、３：アイラ
ンド、４：チツプ、５：パツケージ、８：放熱穴
、９：放熱板、１０：放熱フイン。 1 to 4 illustrate embodiments of this invention, in which FIG. 1 is a cross-sectional view of the electronic device, FIG. 2 is a bottom view of the same, and FIG. 3 is a cross-sectional view of the same with a heat sink attached. 4 is a cross-sectional view of the same with heat dissipation fins attached, and FIG. 5 is a cross-sectional view showing a conventional electronic device. 1: electronic element, 2: printed circuit board, 3: island, 4: chip, 5: package, 8: heat radiation hole, 9: heat sink, 10: heat radiation fin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アイランドの表面にチツプが実装され、このア
イランド及びチツプがパツケージでモールドされ
、このパツケージに放熱穴が穿設され、放熱穴の
一端が外部に開口され、他端が前記アイランドに
おけるチツプ実装面と反対面に面していることを
特徴とする電子素子。 A chip is mounted on the surface of the island, the island and the chip are molded in a package, a heat radiation hole is bored in the package, one end of the heat radiation hole is opened to the outside, and the other end is opposite to the chip mounting surface of the island. An electronic element characterized by facing a surface.
JP1986019667U 1986-02-13 1986-02-13 Pending JPS62131449U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986019667U JPS62131449U (en) 1986-02-13 1986-02-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986019667U JPS62131449U (en) 1986-02-13 1986-02-13

Publications (1)

Publication Number Publication Date
JPS62131449U true JPS62131449U (en) 1987-08-19

Family

ID=30814471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986019667U Pending JPS62131449U (en) 1986-02-13 1986-02-13

Country Status (1)

Country Link
JP (1) JPS62131449U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208755A (en) * 1983-05-12 1984-11-27 Sony Corp Semiconductor device package and manufacture of the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208755A (en) * 1983-05-12 1984-11-27 Sony Corp Semiconductor device package and manufacture of the same

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