JPS63193896U - - Google Patents
Info
- Publication number
- JPS63193896U JPS63193896U JP8460187U JP8460187U JPS63193896U JP S63193896 U JPS63193896 U JP S63193896U JP 8460187 U JP8460187 U JP 8460187U JP 8460187 U JP8460187 U JP 8460187U JP S63193896 U JPS63193896 U JP S63193896U
- Authority
- JP
- Japan
- Prior art keywords
- face
- sides
- diagonal piece
- right sides
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の具体的一実施例の横断面図、
第２図は他の実施例の側面図、第３図は別の実施
例の斜視図、第４〜８図は従来の放熱器の縦断面
図である。
１……左側片、２……右側片、３……斜片、４
……放熱フイン、１１，１１′……パワートラン
ジスタあるいはパワー用ＩＣ（放熱半導体素子の
例）、１２，１２′，２２，３１……プリント基
板。
FIG. 1 is a cross-sectional view of a specific embodiment of the present invention.
FIG. 2 is a side view of another embodiment, FIG. 3 is a perspective view of another embodiment, and FIGS. 4 to 8 are vertical sectional views of a conventional heat radiator. 1... Left side piece, 2... Right side piece, 3... Diagonal piece, 4
... Heat dissipation fin, 11, 11'... Power transistor or power IC (example of heat dissipation semiconductor element), 12, 12', 22, 31... Printed circuit board.
Claims (1)
端と右側片他端とを斜片で連らね、斜片の両面に
放熱フインを突設した概略Ｎ字形断面の形材より
なる放熱器であつて、左右側片一端面および左右
側片他端面に熱発生半導体素子を取付け得るよう
にし、左側片一端と右側片一端間および左側片他
端と右側片他端間にプリント基板を架設できるよ
うにしたことを特徴とする電子部品取付用放熱器
。 The left side and the right side are arranged in parallel, one end of the left side and the other end of the right side are connected by a diagonal piece, and the body has a roughly N-shaped cross section with heat dissipation fins protruding from both sides of the diagonal piece. The heat sink is such that a heat generating semiconductor element can be attached to one end face of the left and right sides and the other end face of the left and right sides, and a printed circuit board is installed between one end of the left side and one end of the right side, and between the other end of the left side and the other end of the right side. A radiator for mounting electronic components, characterized in that it can be installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8460187U JPH0343751Y2 (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8460187U JPH0343751Y2 (en) | 1987-05-29 | 1987-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63193896U true JPS63193896U (en) | 1988-12-14 |
| JPH0343751Y2 JPH0343751Y2 (en) | 1991-09-12 |
Family
ID=30939246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8460187U Expired JPH0343751Y2 (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343751Y2 (en) |
-
1987
- 1987-05-29 JP JP8460187U patent/JPH0343751Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0343751Y2 (en) | 1991-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63193896U (en) | ||
| JPS63167796U (en) | ||
| JPS6416642U (en) | ||
| JPS5911452U (en) | Electronic component equipment with heat sink | |
| JPH028097U (en) | ||
| JPH0334292U (en) | ||
| JPS63128742U (en) | ||
| JPS6022841U (en) | radiator | |
| JPH02102741U (en) | ||
| JPS59121892U (en) | heat dissipation device | |
| JPS59177955U (en) | Heatsink used for printed wiring boards | |
| JPH0221794U (en) | ||
| JPH0455192U (en) | ||
| JPS583046U (en) | Cooler for semiconductor equipment | |
| JPS5981041U (en) | Integrated circuit heat dissipation device | |
| JPS63128741U (en) | ||
| JPH0415892U (en) | ||
| JPS5965545U (en) | heat sink | |
| JPS5818351U (en) | Semiconductor device cooling equipment | |
| JPH0160545U (en) | ||
| JPS594646U (en) | Heat sink mounting device | |
| JPS6052632U (en) | Power semiconductor devices | |
| JPS59111097U (en) | semiconductor equipment | |
| JPS6149458U (en) | ||
| JPS60169846U (en) | Inverter device |