JPS6416642U - - Google Patents
Info
- Publication number
- JPS6416642U JPS6416642U JP11045187U JP11045187U JPS6416642U JP S6416642 U JPS6416642 U JP S6416642U JP 11045187 U JP11045187 U JP 11045187U JP 11045187 U JP11045187 U JP 11045187U JP S6416642 U JPS6416642 U JP S6416642U
- Authority
- JP
- Japan
- Prior art keywords
- spring
- heat dissipation
- semiconductor
- leaf spring
- fixing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の半導体の放熱装置の一実施例
で放熱器に半導体を固定用板バネで装着した状態
を示す斜視図、第２図は組立過程を示す側面図、
第３図は組立完了を示す側面図、第４図は従来例
で放熱器に、半導体を直接ネジで固定したものの
斜視図、第５図も従来例で放熱器に、板バネを使
用してネジ固定した例の斜視図である。
１１……放熱器、１１ａ……放熱用フイン、１
２……係合突起、１３……半導体、１４……固定
用板バネ、１５……プリント基板、１６……放熱
器用義足、１７……挿入孔、１８……半導体のリ
ード、１９……挿入孔、２０……Ｕ字形のバネ固
定部。
FIG. 1 is a perspective view showing an embodiment of the semiconductor heat dissipation device of the present invention, in which a semiconductor is attached to the heat sink with a fixing leaf spring, and FIG. 2 is a side view showing the assembly process.
Figure 3 is a side view showing the completed assembly, Figure 4 is a perspective view of a conventional example in which the semiconductor is directly fixed to the heatsink with screws, and Figure 5 is also a conventional example in which a leaf spring is used for the heatsink. It is a perspective view of an example fixed with screws. 11... Heat radiator, 11a... Heat radiation fin, 1
2... Engaging protrusion, 13... Semiconductor, 14... Fixing plate spring, 15... Printed circuit board, 16... Prosthetic leg for radiator, 17... Insertion hole, 18... Semiconductor lead, 19... Insertion Hole, 20... U-shaped spring fixing part.
Claims (1)
なる放熱器の、半導体取付面と同一面に放熱をか
ねたＵ字形のバネ固定部を形成し、そのバネ固定
部の内側に７字形した半導体固定用板バネを挿入
し、その固定用板バネの圧力で半導体を放熱器に
固定すると同時に、バネ固定部の１端に板バネ端
が当るバネの戻り防止をかねた係合突起を設けて
なる半導体の放熱装置。 A heatsink made of extruded aluminum with multiple heat dissipation fins has a U-shaped spring fixing part for heat dissipation on the same surface as the semiconductor mounting surface, and a 7-shaped part inside the spring fixing part is used for fixing semiconductors. A semiconductor device in which a leaf spring is inserted and the semiconductor is fixed to a heat sink by the pressure of the fixing leaf spring, and at the same time an engaging protrusion is provided on one end of the spring fixing part to prevent the spring from returning so that the end of the leaf spring comes into contact with it. heat dissipation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11045187U JPH0617309Y2 (en) | 1987-07-17 | 1987-07-17 | Semiconductor heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11045187U JPH0617309Y2 (en) | 1987-07-17 | 1987-07-17 | Semiconductor heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6416642U true JPS6416642U (en) | 1989-01-27 |
| JPH0617309Y2 JPH0617309Y2 (en) | 1994-05-02 |
Family
ID=31347623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11045187U Expired - Lifetime JPH0617309Y2 (en) | 1987-07-17 | 1987-07-17 | Semiconductor heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617309Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010079337A (en) * | 2001-07-07 | 2001-08-22 | 유동수 | Fixture for fixing power transistor on heat sink |
| JP2002343910A (en) * | 2001-05-17 | 2002-11-29 | Tetsuji Kataoka | Heat sink and its manufacturing method |
| CN104853566A (en) * | 2014-02-13 | 2015-08-19 | 欧姆龙汽车电子株式会社 | Electronic component fixing structure and method for fixing electronic component |
-
1987
- 1987-07-17 JP JP11045187U patent/JPH0617309Y2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343910A (en) * | 2001-05-17 | 2002-11-29 | Tetsuji Kataoka | Heat sink and its manufacturing method |
| KR20010079337A (en) * | 2001-07-07 | 2001-08-22 | 유동수 | Fixture for fixing power transistor on heat sink |
| CN104853566A (en) * | 2014-02-13 | 2015-08-19 | 欧姆龙汽车电子株式会社 | Electronic component fixing structure and method for fixing electronic component |
| JP2015153888A (en) * | 2014-02-13 | 2015-08-24 | オムロンオートモーティブエレクトロニクス株式会社 | Fixing structure and fix method of electronic component |
| CN104853566B (en) * | 2014-02-13 | 2018-03-27 | 欧姆龙汽车电子株式会社 | The method of the fixed structure of electronic unit and fixed electronic unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617309Y2 (en) | 1994-05-02 |
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