JPH0426550U - - Google Patents
Info
- Publication number
- JPH0426550U JPH0426550U JP6751390U JP6751390U JPH0426550U JP H0426550 U JPH0426550 U JP H0426550U JP 6751390 U JP6751390 U JP 6751390U JP 6751390 U JP6751390 U JP 6751390U JP H0426550 U JPH0426550 U JP H0426550U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- wiring board
- printed wiring
- heat
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の第１の実施例を示すもので、
ａは取付け金具装着前の半導体素子の実装斜視図
、ｂは取付け金具装着後の半導体素子の実装完了
状態の側面図、第２図は同上の照明器具内蔵状態
を示す一部断面側面図、第３図は、本考案の第２
の実施例を示すもので、ａは要部分解斜視図、ｂ
は放熱板に板ばねを装着した状態の側面図、ｃは
実装完了状態の側面図、第４図は従来の半導体装
置の放熱構造を示すもので、ａは取付き金具装着
前の半導体素子の実装斜視図、ｂは取付け金具装
着後の半導体素子の実装側面図、第５図は同上の
照明器具内蔵状態を示す一部断面側面図である。
１……半導体素子、２……本体部、３……リー
ド線部、４……プリント配線基板、５……放熱板
、５ａ……平面部、５ｂ……放熱フイン、８……
照明器具。
FIG. 1 shows a first embodiment of the present invention.
Fig. 2a is a perspective view of the semiconductor device mounted before the mounting bracket is attached, b is a side view of the semiconductor device in the completed state of mounting after the mounting bracket is attached, Fig. 2 is a partial cross-sectional side view showing the same lighting fixture built-in state; Figure 3 shows the second part of this invention.
1 is an exploded perspective view of a main part, b is an exploded perspective view of a main part,
Figure 4 shows a side view of the plate spring attached to the heat sink, c is a side view of the completed mounting state, Figure 4 shows the heat radiation structure of a conventional semiconductor device, and a is a side view of the semiconductor element before the mounting bracket is attached. Fig. 5 is a perspective view of the mounting, b is a side view of the mounting of the semiconductor element after the mounting bracket is attached, and Fig. 5 is a partially sectional side view showing the same lighting equipment as above. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Main body part, 3... Lead wire part, 4... Printed wiring board, 5... Heat sink, 5a... Planar part, 5b... Heat sink fin, 8...
lighting equipment.
Claims (1)
れ、そのプリント配線基板と共に照明器具に内蔵
される半導体素子であつて、前記半導体素子の本
体部に放熱フインを有する放熱板の平面部側を当
接させて放熱が採られる半導体素子の放熱構造に
おいて、前記放熱板の放熱フインを前記プリント
配線基板と略平行に設けたことを特徴とする半導
体素子の放熱構造。 A semiconductor element that is mounted on a printed wiring board via a lead wire part and built into a lighting fixture together with the printed wiring board, wherein the flat side of a heat sink having heat radiation fins is brought into contact with the main body of the semiconductor element. What is claimed is: 1. A heat dissipation structure for a semiconductor device in which heat dissipation is achieved by dissipating heat, wherein the heat dissipation fins of the heat dissipation plate are provided substantially parallel to the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6751390U JPH0426550U (en) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6751390U JPH0426550U (en) | 1990-06-26 | 1990-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426550U true JPH0426550U (en) | 1992-03-03 |
Family
ID=31601148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6751390U Pending JPH0426550U (en) | 1990-06-26 | 1990-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426550U (en) |
-
1990
- 1990-06-26 JP JP6751390U patent/JPH0426550U/ja active Pending