JPS6280340U - - Google Patents
Info
- Publication number
- JPS6280340U JPS6280340U JP17233085U JP17233085U JPS6280340U JP S6280340 U JPS6280340 U JP S6280340U JP 17233085 U JP17233085 U JP 17233085U JP 17233085 U JP17233085 U JP 17233085U JP S6280340 U JPS6280340 U JP S6280340U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- radiator
- spring
- heat
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
Description
第１図はこの考案による放熱器付集積回路の一
実施例を示す斜視図、第２図は第１図の放熱器付
集積回路を印刷配線板に搭載した実施例を示す部
分断面正面図、第３図は従来の放熱器付集積回路
の一例の正面図である。
１１……集積回路、１２……熱伝導材、１３…
…放熱器、１４……ばね（板ばね）、１５……く
ぼみ、１６……凹部。なお、各図中、同一符号は
同一又は相当部分を示す。
FIG. 1 is a perspective view showing an embodiment of the integrated circuit with a heat sink according to this invention, and FIG. 2 is a partially sectional front view showing an embodiment in which the integrated circuit with a heat sink of FIG. 1 is mounted on a printed wiring board. FIG. 3 is a front view of an example of a conventional integrated circuit with a heat sink. 11... integrated circuit, 12... heat conductive material, 13...
...Radiator, 14... Spring (plate spring), 15... Recess, 16... Recess. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
て、この集積回路の外面に設けられる集積回路冷
却用の放熱器と、集積回路および放熱器間に介在
し集積回路の発生熱を効率よく放熱器に伝達する
熱伝導度の高い熱伝導材と、集積回路および放熱
器に係合して放熱器を集積回路に所定位置で所定
圧力をもつて押圧するように構成されているばね
とを備えていることを特徴とする放熱器付集積回
路。 (2) 熱伝導材は、熱伝導度が高いとともに電気
的絶縁性能も良好であり、かつ、ばねも電気絶縁
性を有している実用新案登録請求の範囲第１項記
載の放熱器付集積回路。 (3) 放熱器を集積回路に所定位置においてばね
により押圧する手段が、ばねを板ばねとし、板ば
ねが係合する放熱器および集積回路の係合部分を
板ばねが係止されるように形成した実用新案登録
請求の範囲第１項又は第２項記載の放熱器付集積
回路。[Scope of Claim for Utility Model Registration] (1) In a high heat generation integrated circuit constituting an electronic device, a radiator for cooling the integrated circuit provided on the outer surface of the integrated circuit, and an integrated circuit interposed between the integrated circuit and the radiator. A thermal conductive material with high thermal conductivity that efficiently transfers the generated heat to the radiator, and a structure that engages with the integrated circuit and the radiator to press the radiator against the integrated circuit at a predetermined position and with a predetermined pressure. An integrated circuit with a heatsink, characterized by comprising a spring. (2) The heat-conducting material has high thermal conductivity and good electrical insulating performance, and the spring also has electrical insulating properties. circuit. (3) The means for pressing the radiator against the integrated circuit at a predetermined position by means of a spring is such that the spring is a leaf spring, and the leaf spring is engaged with the engaging portion of the radiator and the integrated circuit. An integrated circuit with a heat sink as claimed in claim 1 or 2 of the registered utility model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17233085U JPS6280340U (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17233085U JPS6280340U (en) | 1985-11-11 | 1985-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6280340U true JPS6280340U (en) | 1987-05-22 |
Family
ID=31108774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17233085U Pending JPS6280340U (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6280340U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02298053A (en) * | 1989-05-12 | 1990-12-10 | Nec Corp | Mounting structure of heat sink |
| JPH04162552A (en) * | 1990-10-25 | 1992-06-08 | Nec Corp | Mounting structure of heat sink |
-
1985
- 1985-11-11 JP JP17233085U patent/JPS6280340U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02298053A (en) * | 1989-05-12 | 1990-12-10 | Nec Corp | Mounting structure of heat sink |
| JPH04162552A (en) * | 1990-10-25 | 1992-06-08 | Nec Corp | Mounting structure of heat sink |
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