JPH0245668U - - Google Patents
Info
- Publication number
- JPH0245668U JPH0245668U JP12538988U JP12538988U JPH0245668U JP H0245668 U JPH0245668 U JP H0245668U JP 12538988 U JP12538988 U JP 12538988U JP 12538988 U JP12538988 U JP 12538988U JP H0245668 U JPH0245668 U JP H0245668U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案のプリント基板搭載電子部品
の放熱装置を示す分解斜視図、第２図は従来の電
子部品のプリント基板への取付け構造を示す斜視
図である。
なお図中１はプリント基板、２は電子部品、４
は底面部、６は放熱層、７は放熱板、８は導熱ピ
ン、９は電気絶縁シートである。その他図中同一
符号は同一または相当部分を示すものとする。
FIG. 1 is an exploded perspective view showing a heat dissipation device for electronic components mounted on a printed circuit board according to the present invention, and FIG. 2 is a perspective view showing a conventional mounting structure for electronic components on a printed circuit board. In the figure, 1 is a printed circuit board, 2 is an electronic component, and 4 is a printed circuit board.
6 is a bottom part, 6 is a heat radiation layer, 7 is a heat radiation plate, 8 is a heat conductive pin, and 9 is an electrically insulating sheet. In other figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
層等の放熱層に、上記プリント基板に搭載される
電子部品の底面部に重合させた放熱板の導熱ピン
を、上記プリント基板に対する電気絶縁シートを
介して熱的に接続させたことを特徴とするプリン
ト基板搭載電子部品の放熱装置。 A heat conductive pin of a heat sink, which is superimposed on the bottom surface of an electronic component mounted on the printed circuit board, is connected to a heat dissipation layer such as a ground layer laminated on the printed circuit board through an electrically insulating sheet to the printed circuit board. A heat dissipation device for electronic components mounted on a printed circuit board, characterized in that the electronic components are thermally connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12538988U JPH0245668U (en) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12538988U JPH0245668U (en) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245668U true JPH0245668U (en) | 1990-03-29 |
Family
ID=31375957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12538988U Pending JPH0245668U (en) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245668U (en) |
-
1988
- 1988-09-26 JP JP12538988U patent/JPH0245668U/ja active Pending
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