JPS646068U - - Google Patents
Info
- Publication number
- JPS646068U JPS646068U JP10058487U JP10058487U JPS646068U JP S646068 U JPS646068 U JP S646068U JP 10058487 U JP10058487 U JP 10058487U JP 10058487 U JP10058487 U JP 10058487U JP S646068 U JPS646068 U JP S646068U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- periphery
- covered
- solder resist
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 239000011889 copper foil Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例におけるプリント基板
の放熱板取付孔周縁を示す平面図、第２図は従来
例の放熱板取付孔周縁を示す平面図、第３図は放
熱板の取付構造の従来例を示す側面図と裏面図で
ある。
１１……放熱板取付孔、１２……レジスト面、
１３……ランド面。
Fig. 1 is a plan view showing the periphery of the heat sink mounting hole of the printed circuit board in the embodiment of the present invention, Fig. 2 is a plan view showing the periphery of the heat sink mounting hole of a conventional example, and Fig. 3 is a plan view of the heat sink mounting structure. It is a side view and a back view which show a conventional example. 11... Heat sink mounting hole, 12... Resist surface,
13...Land surface.
Claims (1)
われている銅箔を形成するとともに、前記銅箔の
周縁にソルダーレジストで覆われていない銅箔を
設けてなるプリント基板。 A printed circuit board comprising a copper foil covered with a solder resist on the periphery of a component mounting hole, and a copper foil not covered with a solder resist on the periphery of the copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10058487U JPS646068U (en) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10058487U JPS646068U (en) | 1987-06-30 | 1987-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646068U true JPS646068U (en) | 1989-01-13 |
Family
ID=31328792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10058487U Pending JPS646068U (en) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646068U (en) |
-
1987
- 1987-06-30 JP JP10058487U patent/JPS646068U/ja active Pending