JPS62184775U - - Google Patents

Info

Publication number
JPS62184775U
JPS62184775U JP7198086U JP7198086U JPS62184775U JP S62184775 U JPS62184775 U JP S62184775U JP 7198086 U JP7198086 U JP 7198086U JP 7198086 U JP7198086 U JP 7198086U JP S62184775 U JPS62184775 U JP S62184775U
Authority
JP
Japan
Prior art keywords
electronic component
substrate
vertical hole
circuit board
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7198086U
Other languages
Japanese (ja)
Other versions
JPH0432780Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986071980U priority Critical patent/JPH0432780Y2/ja
Publication of JPS62184775U publication Critical patent/JPS62184775U/ja
Application granted granted Critical
Publication of JPH0432780Y2 publication Critical patent/JPH0432780Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の実施例に係るプリント基板
の要部断面図、第２図は同底面図、第３図は同分
解断面図、第４図はフレキシブル基板の要部断面
図、第５図は同要部平面図、第６図は他の態様の
フレキシブル基板の要部平面図、第７図から第１
０図は他の実施例のプリント基板の要部断面図、
第１１図は従来のプリント基板の要部断面図であ
る。 １…プリント基板、２…硬質基板（第１の基板
）、２ａ…縦孔、３…リードレスチツプ部品（電
子部品）、４…フレキシブル基板（第２の基板）
、６…パターン。 Fig. 1 is a sectional view of the main parts of a printed circuit board according to an embodiment of this invention, Fig. 2 is a bottom view of the same, Fig. 3 is an exploded sectional view of the same, Fig. 4 is a sectional view of main parts of a flexible board, and Fig. The figure is a plan view of the same main part, FIG. 6 is a plan view of the main part of another embodiment of the flexible substrate, and FIGS.
Figure 0 is a cross-sectional view of the main parts of a printed circuit board of another embodiment,
FIG. 11 is a sectional view of a main part of a conventional printed circuit board. DESCRIPTION OF SYMBOLS 1...Printed board, 2...Hard board (first board), 2a...Vertical hole, 3...Leadless chip component (electronic component), 4...Flexible board (second board)
, 6...pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 第１の基板に電子部品を埋設する縦孔を穿設し
、この第１の基板の少なくとも片面にパターンを
前記縦孔に露出させた第２の基板を貼り付け、前
記縦孔に電子部品を挿入して、該電子部品を前記
第２の基板のパターン上で支持、接続したことを
特徴とするプリント基板。 A vertical hole for embedding an electronic component is formed in a first substrate, a second substrate with a pattern exposed in the vertical hole is pasted on at least one side of the first substrate, and the electronic component is embedded in the vertical hole. A printed circuit board, characterized in that the electronic component is supported and connected on the pattern of the second circuit board by inserting the electronic component.
JP1986071980U 1986-05-14 1986-05-14 Expired JPH0432780Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986071980U JPH0432780Y2 (en) 1986-05-14 1986-05-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986071980U JPH0432780Y2 (en) 1986-05-14 1986-05-14

Publications (2)

Publication Number Publication Date
JPS62184775U true JPS62184775U (en) 1987-11-24
JPH0432780Y2 JPH0432780Y2 (en) 1992-08-06

Family

ID=30915017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986071980U Expired JPH0432780Y2 (en) 1986-05-14 1986-05-14

Country Status (1)

Country Link
JP (1) JPH0432780Y2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170050A (en) * 1993-12-15 1995-07-04 Nec Corp Semiconductor device
JPH07321439A (en) * 1994-05-27 1995-12-08 O K Print:Kk Component mounting board for memory device
JP2005302854A (en) * 2004-04-08 2005-10-27 Fujikura Ltd Component built-in double-sided board, component built-in double-sided wiring board, and manufacturing method thereof
JP2013179144A (en) * 2012-02-28 2013-09-09 Murata Mfg Co Ltd Component built-in resin multilayer substrate and manufacturing method therefor
JPWO2016189609A1 (en) * 2015-05-25 2018-03-15 オリンパス株式会社 3D wiring board and 3D wiring board manufacturing method
WO2023276413A1 (en) * 2021-06-30 2023-01-05 株式会社村田製作所 Electronic module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3659167B2 (en) 1999-04-16 2005-06-15 松下電器産業株式会社 Module parts and manufacturing method thereof
JP2001298274A (en) * 2001-03-13 2001-10-26 Matsushita Electric Ind Co Ltd Electronic circuit components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5476974A (en) * 1977-12-02 1979-06-20 Matsushita Electric Industrial Co Ltd Printed circuit board with light emitting diode
JPS5930549U (en) * 1982-08-20 1984-02-25 自動車機器技術研究組合 Fuel pressure control device of fuel supply system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5476974A (en) * 1977-12-02 1979-06-20 Matsushita Electric Industrial Co Ltd Printed circuit board with light emitting diode
JPS5930549U (en) * 1982-08-20 1984-02-25 自動車機器技術研究組合 Fuel pressure control device of fuel supply system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170050A (en) * 1993-12-15 1995-07-04 Nec Corp Semiconductor device
JPH07321439A (en) * 1994-05-27 1995-12-08 O K Print:Kk Component mounting board for memory device
JP2005302854A (en) * 2004-04-08 2005-10-27 Fujikura Ltd Component built-in double-sided board, component built-in double-sided wiring board, and manufacturing method thereof
JP2013179144A (en) * 2012-02-28 2013-09-09 Murata Mfg Co Ltd Component built-in resin multilayer substrate and manufacturing method therefor
JPWO2016189609A1 (en) * 2015-05-25 2018-03-15 オリンパス株式会社 3D wiring board and 3D wiring board manufacturing method
WO2023276413A1 (en) * 2021-06-30 2023-01-05 株式会社村田製作所 Electronic module

Also Published As

Publication number Publication date
JPH0432780Y2 (en) 1992-08-06

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