JPS63131167U - - Google Patents
Info
- Publication number
- JPS63131167U JPS63131167U JP2208087U JP2208087U JPS63131167U JP S63131167 U JPS63131167 U JP S63131167U JP 2208087 U JP2208087 U JP 2208087U JP 2208087 U JP2208087 U JP 2208087U JP S63131167 U JPS63131167 U JP S63131167U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pattern
- leaving
- predetermined distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例のプリント基板の要
部構成を示す平面図、第２図は第１図のプリント
基板に電子部品及び非半田付け部材を実装した状
態を示す側面図、第３図は従来例のプリント基板
に電子部品及び非半田付け部材を実装した状態を
示す側面図、第４図は第３図のプリント基板のパ
ターン面側の平面図である。
２……プリント基板、３……放熱板、８……ガ
イドホール、１０……半田付着用パターン、１１
……小孔。
FIG. 1 is a plan view showing the configuration of the main parts of a printed circuit board according to an embodiment of the present invention, FIG. 2 is a side view showing the printed circuit board of FIG. 3 is a side view showing a state in which electronic components and non-soldering members are mounted on a conventional printed circuit board, and FIG. 4 is a plan view of the pattern surface side of the printed circuit board of FIG. 3. 2... Printed circuit board, 3... Heat sink, 8... Guide hole, 10... Solder adhesion pattern, 11
...Small hole.
Claims (1)
付け部材の周囲に、所定距離残して半田付着用パ
ターンを形成し、且つそのパターン上に小孔を穿
設したことを特徴とするプリント基板。 1. A printed circuit board, characterized in that a solder adhesion pattern is formed around a non-soldering member existing on the pattern side of the printed circuit board, leaving a predetermined distance, and small holes are formed on the pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2208087U JPS63131167U (en) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2208087U JPS63131167U (en) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131167U true JPS63131167U (en) | 1988-08-26 |
Family
ID=30819122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2208087U Pending JPS63131167U (en) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131167U (en) |
-
1987
- 1987-02-19 JP JP2208087U patent/JPS63131167U/ja active Pending