JPS61144669U - - Google Patents
Info
- Publication number
- JPS61144669U JPS61144669U JP2774485U JP2774485U JPS61144669U JP S61144669 U JPS61144669 U JP S61144669U JP 2774485 U JP2774485 U JP 2774485U JP 2774485 U JP2774485 U JP 2774485U JP S61144669 U JPS61144669 U JP S61144669U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- board
- circuit component
- leadless circuit
- regulating member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案になる基板への部品実装機構の
好適な一実施例を示す外観斜視図、第２図は実装
工程を示す説明図である。
１ａ，１ｂ……パターン、２……基板、３……
リードレス回路部品、４……透孔、７……デイス
クリート回路部品。
FIG. 1 is an external perspective view showing a preferred embodiment of a component mounting mechanism on a board according to the present invention, and FIG. 2 is an explanatory view showing the mounting process. 1a, 1b...Pattern, 2...Substrate, 3...
Leadless circuit component, 4...Through hole, 7...Discrete circuit component.
Claims (1)
リードレス回路部品の形状と略対応した形状の透
孔を前記パターンを分割するよう穿設すると共に
、前記基板の一側面の前記透孔と対応する位置に
位置規制部材を取付けてなり、前記リードレス回
路部品を前記基板の他側面より透孔内に配置して
前記位置規制部材に当接させ、前記分割されたパ
ターン相互をこのリードレス回路部品を介して電
気的に接続したことを特徴とする基板への部品実
装機構。 A through hole having a shape substantially corresponding to the shape of the leadless circuit component to be mounted is formed in a board on which a predetermined pattern has been formed so as to divide the pattern, and also corresponding to the through hole on one side of the board. A position regulating member is attached to the position, and the leadless circuit component is placed in the through hole from the other side of the substrate and brought into contact with the position regulating member, and the divided patterns are connected to each other in the leadless circuit component. A component mounting mechanism on a board, characterized in that it is electrically connected via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2774485U JPS61144669U (en) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2774485U JPS61144669U (en) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144669U true JPS61144669U (en) | 1986-09-06 |
Family
ID=30524977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2774485U Pending JPS61144669U (en) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144669U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102716A (en) * | 1999-09-29 | 2001-04-13 | Nec Saitama Ltd | Electronic apparatus |
-
1985
- 1985-02-27 JP JP2774485U patent/JPS61144669U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102716A (en) * | 1999-09-29 | 2001-04-13 | Nec Saitama Ltd | Electronic apparatus |