JPH0236068U - - Google Patents
Info
- Publication number
- JPH0236068U JPH0236068U JP11551688U JP11551688U JPH0236068U JP H0236068 U JPH0236068 U JP H0236068U JP 11551688 U JP11551688 U JP 11551688U JP 11551688 U JP11551688 U JP 11551688U JP H0236068 U JPH0236068 U JP H0236068U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed board
- solid pattern
- dummy
- penetrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案によるプリント板の実施例に係
り、第１図ａは平面図、第１図ｂは断面図、第１
図ｃは底面図、第２図は従来のプリント板に係り
、第２図ａは平面図、第２図ｂは断面図、第２図
ｃは底面図である。
１……プリント板、２……絶縁基板、３……ベ
タパターン、４……部品、４ａ……リード、５…
…スルーホール、７……ダミースルーホール。
FIG. 1 shows an embodiment of the printed board according to the present invention, in which FIG. 1a is a plan view, FIG. 1b is a sectional view, and FIG.
Fig. 2c is a bottom view, Fig. 2 is a conventional printed board, Fig. 2a is a plan view, Fig. 2b is a sectional view, and Fig. 2c is a bottom view. 1... Printed board, 2... Insulating board, 3... Solid pattern, 4... Parts, 4a... Lead, 5...
...Through hole, 7...Dummy through hole.
Claims (1)
品のリードをはんだ槽ではんだ付けするためのス
ルーホールをベタパターンを貫通させて形成した
プリント板において、 ベタパターンを貫通するダミースルーホールを
前記スルーホールの近傍に形成したことを特徴と
するプリント板。[Scope of Claim for Utility Model Registration] A printed board in which a solid pattern is formed on the mounting surface of an insulating substrate, and through holes for soldering component leads in a solder bath are formed through the solid pattern. A printed board characterized in that a penetrating dummy through hole is formed near the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11551688U JPH0236068U (en) | 1988-09-01 | 1988-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11551688U JPH0236068U (en) | 1988-09-01 | 1988-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236068U true JPH0236068U (en) | 1990-03-08 |
Family
ID=31357247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11551688U Pending JPH0236068U (en) | 1988-09-01 | 1988-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236068U (en) |
-
1988
- 1988-09-01 JP JP11551688U patent/JPH0236068U/ja active Pending