JPS61100176U - - Google Patents
Info
- Publication number
- JPS61100176U JPS61100176U JP18629584U JP18629584U JPS61100176U JP S61100176 U JPS61100176 U JP S61100176U JP 18629584 U JP18629584 U JP 18629584U JP 18629584 U JP18629584 U JP 18629584U JP S61100176 U JPS61100176 U JP S61100176U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- component mounting
- printed wiring
- view
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図ａは本考案に係るプリント配線基板の一
実施例の要部平面図、第１図ｂは第１図ａの断面
図、第２図は従来のプリント配線基板およびその
実装状態を示す要部断面図、第３図ａはチツプ部
品を搭載するためのランドとクリーム半田の関係
を示す側面図、第３図ｂは第３図ａにチツプ部品
を搭載した側面図、第４図ａはチツプ部品ランド
にスルーホールが近接して配置されたときのチツ
プ部品が実装された状態の平面図、第４図ｂは第
３図ａの断面図、第５図はチツプ部品ランドが近
接して配置されたときのチツプ部品が実装された
状態の平面図である。
１……プリント配線基板、４……スルーホール
メツキ部、１１……チツプ部品を搭載するランド
、２１……マーキング部材。
Figure 1a is a plan view of essential parts of an embodiment of the printed wiring board according to the present invention, Figure 1b is a sectional view of Figure 1a, and Figure 2 shows a conventional printed wiring board and its mounting state. 3a is a side view showing the relationship between the land and cream solder for mounting chip components; FIG. 3b is a side view of FIG. 3a with chip components mounted; FIG. 4a is a plan view of the chip component mounted when the through hole is placed close to the chip component land, FIG. 4b is a sectional view of FIG. 3a, and FIG. FIG. 3 is a plan view of a state in which chip components are mounted when arranged as shown in FIG. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 4... Through-hole plating part, 11... Land on which chip parts are mounted, 21... Marking member.
Claims (1)
間と、チツプ部品搭載用ランドとスルーホールメ
ツキ部の間の少なくとも一方に、所要の厚さのマ
ーキング部材を設けたことを特徴とするプリント
配線基板。 A printed wiring characterized in that a marking member of a required thickness is provided between at least one of the adjacent chip component mounting lands and between the chip component mounting land and the through-hole plated portion. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18629584U JPS61100176U (en) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18629584U JPS61100176U (en) | 1984-12-07 | 1984-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100176U true JPS61100176U (en) | 1986-06-26 |
Family
ID=30743762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18629584U Pending JPS61100176U (en) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100176U (en) |
-
1984
- 1984-12-07 JP JP18629584U patent/JPS61100176U/ja active Pending