JPS61136576U - - Google Patents
Info
- Publication number
- JPS61136576U JPS61136576U JP1977885U JP1977885U JPS61136576U JP S61136576 U JPS61136576 U JP S61136576U JP 1977885 U JP1977885 U JP 1977885U JP 1977885 U JP1977885 U JP 1977885U JP S61136576 U JPS61136576 U JP S61136576U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- circuit board
- printed circuit
- soldering
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図〜第３図は、本考案の一実施例を示すも
ので、第１図は、チツプ部品のみが片面実装され
る場合のプリント基板の断面図、第２図及び第３
図は、チツプ部品とデイスクリート部品とが両面
実装される場合のプリント基板の断面図、そして
第４図〜第７図は従来の実施例を示す断面図であ
る。
１……チツプ部品、２……チツプ部品端子部、
３……半田、５……プリント基板、２７……スル
ーホール部。
1 to 3 show an embodiment of the present invention. FIG. 1 is a sectional view of a printed circuit board in which only chip components are mounted on one side, and FIGS.
The figure is a sectional view of a printed circuit board in which chip components and discrete components are mounted on both sides, and FIGS. 4 to 7 are sectional views showing conventional embodiments. 1... Chip parts, 2... Chip parts terminals,
3...Solder, 5...Printed circuit board, 27...Through hole section.
Claims (1)
プリント基板において、チツプ部品端子下部のプ
リント基板にスルーホール部を設け、チツプ部品
端子部とスルーホール部を半田付接続したことを
特徴とするチツプ部品実装のプリント基板。 Chip component mounting characterized in that, in a printed circuit board for chip component mounting in which chip components are connected by soldering, a through-hole section is provided in the printed circuit board below the chip component terminal, and the chip component terminal section and the through-hole section are connected by soldering. printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977885U JPS61136576U (en) | 1985-02-14 | 1985-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977885U JPS61136576U (en) | 1985-02-14 | 1985-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61136576U true JPS61136576U (en) | 1986-08-25 |
Family
ID=30509664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977885U Pending JPS61136576U (en) | 1985-02-14 | 1985-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136576U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09167884A (en) * | 1996-10-21 | 1997-06-24 | Hokuriku Electric Ind Co Ltd | Circuit board |
| WO2024024397A1 (en) * | 2022-07-28 | 2024-02-01 | 日置電機株式会社 | Damper and measurement device |
-
1985
- 1985-02-14 JP JP1977885U patent/JPS61136576U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09167884A (en) * | 1996-10-21 | 1997-06-24 | Hokuriku Electric Ind Co Ltd | Circuit board |
| WO2024024397A1 (en) * | 2022-07-28 | 2024-02-01 | 日置電機株式会社 | Damper and measurement device |
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