JPH0455162U - - Google Patents
Info
- Publication number
- JPH0455162U JPH0455162U JP9765390U JP9765390U JPH0455162U JP H0455162 U JPH0455162 U JP H0455162U JP 9765390 U JP9765390 U JP 9765390U JP 9765390 U JP9765390 U JP 9765390U JP H0455162 U JPH0455162 U JP H0455162U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electronic component
- electrode portion
- lead portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例による電子部品搭載
プリント基板の断面図、第２図は本考案の他の実
施例による電子部品搭載プリント基板の断面図、
第３図は従来例による電子部品搭載プリント基板
の断面図、第４図は他の従来例による電子部品搭
載プリント基板の断面図、第５図は第３図に示す
従来例の問題点を説明するための断面図である。
２……電子部品、３……プリント基板、４……
電極部、５……リード部、６……半田、７，７′
……導電ペースト。
FIG. 1 is a cross-sectional view of a printed circuit board with electronic components according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a printed circuit board with electronic components according to another embodiment of the present invention,
Fig. 3 is a sectional view of a conventional printed circuit board with electronic components mounted, Fig. 4 is a sectional view of another conventional printed circuit board with electronic components mounted, and Fig. 5 explains the problems of the conventional example shown in Fig. 3. FIG. 2...Electronic components, 3...Printed circuit boards, 4...
Electrode part, 5...Lead part, 6...Solder, 7, 7'
...Conductive paste.
Claims (1)
リント基板の電極部に固定するとともに、半田付
けにより前記リード部と前記電極部とを接続して
なることを特徴とする電子部品搭載プリント基板
。 1. A printed circuit board with an electronic component mounted thereon, characterized in that a lead portion of an electronic component is fixed to an electrode portion of a printed circuit board via a conductive paste, and the lead portion and the electrode portion are connected by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9765390U JPH0455162U (en) | 1990-09-13 | 1990-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9765390U JPH0455162U (en) | 1990-09-13 | 1990-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0455162U true JPH0455162U (en) | 1992-05-12 |
Family
ID=31838215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9765390U Pending JPH0455162U (en) | 1990-09-13 | 1990-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455162U (en) |
-
1990
- 1990-09-13 JP JP9765390U patent/JPH0455162U/ja active Pending