JPH0459182U - - Google Patents
Info
- Publication number
- JPH0459182U JPH0459182U JP10127490U JP10127490U JPH0459182U JP H0459182 U JPH0459182 U JP H0459182U JP 10127490 U JP10127490 U JP 10127490U JP 10127490 U JP10127490 U JP 10127490U JP H0459182 U JPH0459182 U JP H0459182U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead terminal
- circuit board
- printed circuit
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
それに部品を実装する状態の切断側面図、第３図
は従来プリント基板の平面図、第４図はそれに部
品を実装した状態の切断側面図である。
１……集積回路（リード端子付電子部品）、２
……リード端子、６……半田、７……プリント基
板、８……配線パターン、８′……パターンエツ
ジ。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a cutaway side view of a state in which parts are mounted on it, Fig. 3 is a plan view of a conventional printed circuit board, and Fig. 4 is a state in which parts are mounted on it. FIG. 1...Integrated circuit (electronic component with lead terminal), 2
... Lead terminal, 6 ... Solder, 7 ... Printed circuit board, 8 ... Wiring pattern, 8' ... Pattern edge.
Claims (1)
装するプリント基板において、前記電子部品の各
リード端子を半田付けにより各々接続する各配線
パターンを、各々のパターンエツジが所定箇所に
載置される該電子部品における各リード端子の外
側面に少許の間隙で近接対向する形状としたこと
を特徴とするプリント基板。 In a printed circuit board on which an electronic component with lead terminals is surface mounted by soldering, each wiring pattern connecting each lead terminal of the electronic component by soldering is connected to the electronic component in which each pattern edge is placed at a predetermined location. 1. A printed circuit board characterized in that each lead terminal has a shape that is closely opposed to the outer surface of each lead terminal with a small gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10127490U JPH0459182U (en) | 1990-09-26 | 1990-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10127490U JPH0459182U (en) | 1990-09-26 | 1990-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459182U true JPH0459182U (en) | 1992-05-21 |
Family
ID=31844589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10127490U Pending JPH0459182U (en) | 1990-09-26 | 1990-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459182U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08172258A (en) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | Mounting method of electronic component |
-
1990
- 1990-09-26 JP JP10127490U patent/JPH0459182U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08172258A (en) * | 1994-12-16 | 1996-07-02 | Sony Chem Corp | Mounting method of electronic component |