JPH0487681U - - Google Patents
Info
- Publication number
- JPH0487681U JPH0487681U JP13070390U JP13070390U JPH0487681U JP H0487681 U JPH0487681 U JP H0487681U JP 13070390 U JP13070390 U JP 13070390U JP 13070390 U JP13070390 U JP 13070390U JP H0487681 U JPH0487681 U JP H0487681U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- solder portions
- mount components
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案の実施例を示す簡略平面図、
第２図は、同上、作用説明図、第３図は、他の実
施例を示す平面図、第４図は、表面実装電子部品
が基板上に実装されている状態を示す斜視図、第
５図は、従来例の簡略平面図、第６図は、同上、
作用説明図である。
１１……プリント基板、１２……銅箔パターン
、１３……半田付部。
FIG. 1 is a simplified plan view showing an embodiment of the present invention;
FIG. 2 is an explanatory diagram of the same operation as above; FIG. 3 is a plan view showing another embodiment; FIG. 4 is a perspective view showing a state in which surface-mounted electronic components are mounted on a board; The figure is a simplified plan view of the conventional example, and FIG. 6 is the same as above.
It is an action explanatory diagram. 11... Printed circuit board, 12... Copper foil pattern, 13... Soldering part.
Claims (1)
一対の半田付部の各々の周囲に、上記表面実装部
品と接続される銅箔パターンを上記各半田付部よ
り四方向に引き出し形成したことを特徴とする表
面実装部品の接続部の構造。 A copper foil pattern to be connected to the surface mount component is formed around each of a pair of solder portions for surface mount components formed on the printed circuit board in four directions from each of the solder portions. The structure of the connection part of surface mount components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13070390U JPH0487681U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13070390U JPH0487681U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487681U true JPH0487681U (en) | 1992-07-30 |
Family
ID=31878020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13070390U Pending JPH0487681U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487681U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013105853A (en) * | 2011-11-11 | 2013-05-30 | Denso Corp | Wiring board |
-
1990
- 1990-11-30 JP JP13070390U patent/JPH0487681U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013105853A (en) * | 2011-11-11 | 2013-05-30 | Denso Corp | Wiring board |