JPS6230380U - - Google Patents
Info
- Publication number
- JPS6230380U JPS6230380U JP12224885U JP12224885U JPS6230380U JP S6230380 U JPS6230380 U JP S6230380U JP 12224885 U JP12224885 U JP 12224885U JP 12224885 U JP12224885 U JP 12224885U JP S6230380 U JPS6230380 U JP S6230380U
- Authority
- JP
- Japan
- Prior art keywords
- land
- sub
- lead
- electronic component
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はプリント基板に適用された本考案の一
実施例の斜視図、第２図は第１図の実施例の断面
図、第３図は溶融半田に浸漬する前の第１図の実
施例の斜視図、第４図は従来装置の斜視図である
。
１…プリント基板、２…パターン、３…ランド
、４…リード、６…サブランド、８…電子部品、
９…レジスト、１０…半田盛り。
Fig. 1 is a perspective view of an embodiment of the present invention applied to a printed circuit board, Fig. 2 is a sectional view of the embodiment of Fig. 1, and Fig. 3 is an implementation of the embodiment of Fig. 1 before being immersed in molten solder. An example perspective view, FIG. 4 is a perspective view of a conventional device. 1...Printed circuit board, 2...pattern, 3...land, 4...lead, 6...subland, 8...electronic component,
9...Resist, 10...Solder pile.
Claims (1)
ドと所要間隔のレジストを介して分離形成され、
電子部品のリードは前記ランドの孔部から突出さ
れ、前記サブランド方向へ折曲げられ、前記ラン
ドおよびサブランドに半田盛りが形成されること
により前記電子部品のリードが前記ランドおよび
サブランドに電気的に接続されることを特徴とす
るプリント基板への電子部品接続装置。 In the same copper foil pattern, a sub-land is formed separately from the land via a resist at a required interval,
The lead of the electronic component is projected from the hole of the land and bent toward the sub-land, and a solder mound is formed on the land and the sub-land, so that the lead of the electronic component is electrically connected to the land and the sub-land. An apparatus for connecting electronic components to a printed circuit board, characterized in that the electronic components are connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12224885U JPS6230380U (en) | 1985-08-09 | 1985-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12224885U JPS6230380U (en) | 1985-08-09 | 1985-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230380U true JPS6230380U (en) | 1987-02-24 |
Family
ID=31012261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12224885U Pending JPS6230380U (en) | 1985-08-09 | 1985-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230380U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291759A (en) * | 1992-04-14 | 1993-11-05 | Tokyo Electric Co Ltd | Electrical parts storage case |
-
1985
- 1985-08-09 JP JP12224885U patent/JPS6230380U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291759A (en) * | 1992-04-14 | 1993-11-05 | Tokyo Electric Co Ltd | Electrical parts storage case |
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