JPH0442768U - - Google Patents
Info
- Publication number
- JPH0442768U JPH0442768U JP8524690U JP8524690U JPH0442768U JP H0442768 U JPH0442768 U JP H0442768U JP 8524690 U JP8524690 U JP 8524690U JP 8524690 U JP8524690 U JP 8524690U JP H0442768 U JPH0442768 U JP H0442768U
- Authority
- JP
- Japan
- Prior art keywords
- mounted component
- circuit board
- printed circuit
- copper foil
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
第１図は、本考案の実施例を示す簡略平面図、
第２図は、同上、作用説明図、第３図は、他の実
施例を示す平面図、第４図は、表面実装部品とし
てテストポイント用チツプを用いた例を示す斜視
図、第５図は、従来例の簡略平面図、第６図は、
同上、作用説明図である。
１……プリント基板、２……銅箔パターン、３
……半田付部。
FIG. 1 is a simplified plan view showing an embodiment of the present invention;
FIG. 2 is an explanatory view of the same operation, FIG. 3 is a plan view showing another embodiment, FIG. 4 is a perspective view showing an example using a test point chip as a surface mount component, and FIG. 5 is a simplified plan view of the conventional example, and FIG.
Same as above, it is an action explanatory diagram. 1...Printed circuit board, 2...Copper foil pattern, 3
...Soldering part.
Claims (1)
半田付部の周囲少なくとも四方向に該表面実装部
品と接続される銅箔パターンを引き出し形成した
ことを特徴とする表面実装部品の接続部の構造。 1. A structure for a connecting part of a surface-mounted component, characterized in that a copper foil pattern is drawn out and formed in at least four directions around a soldered part for the surface-mounted component formed on a printed circuit board to be connected to the surface-mounted component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8524690U JPH0442768U (en) | 1990-08-09 | 1990-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8524690U JPH0442768U (en) | 1990-08-09 | 1990-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442768U true JPH0442768U (en) | 1992-04-10 |
Family
ID=31634271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8524690U Pending JPH0442768U (en) | 1990-08-09 | 1990-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442768U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01158793A (en) * | 1987-12-15 | 1989-06-21 | Matsushita Electric Ind Co Ltd | Chip component mounting device |
-
1990
- 1990-08-09 JP JP8524690U patent/JPH0442768U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01158793A (en) * | 1987-12-15 | 1989-06-21 | Matsushita Electric Ind Co Ltd | Chip component mounting device |