JPH0418474U - - Google Patents
Info
- Publication number
- JPH0418474U JPH0418474U JP5724290U JP5724290U JPH0418474U JP H0418474 U JPH0418474 U JP H0418474U JP 5724290 U JP5724290 U JP 5724290U JP 5724290 U JP5724290 U JP 5724290U JP H0418474 U JPH0418474 U JP H0418474U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- land portions
- substrate
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図及び第２図は本考案のプリント配線板の
一実施例を説明する図であり、第１図は要部断面
図、第２図は要部平面図である。第３図及び第４
図は従来のプリント配線板を説明する図であり、
第３図は要部断面図、第４図は要部平面図である
。
２１……プリント配線板、２２……チツプ部品
、２４……電極部、２６……ランド部、２７……
基板、３０……部品載置部。
1 and 2 are diagrams illustrating an embodiment of the printed wiring board of the present invention, with FIG. 1 being a sectional view of the main part, and FIG. 2 being a plan view of the main part. Figures 3 and 4
The figure is a diagram explaining a conventional printed wiring board,
FIG. 3 is a sectional view of the main part, and FIG. 4 is a plan view of the main part. 21... Printed wiring board, 22... Chip parts, 24... Electrode section, 26... Land section, 27...
Board, 30...Component placement section.
Claims (1)
付けされる一対のランド部が基板に設けられてい
るプリント配線板において、前記基板には前記ラ
ンド部よりも高く突出させられた部品載置部が前
記一対ランド部の間に設けられていることを特徴
とするプリント配線板。 In a printed wiring board in which a substrate is provided with a pair of land portions to which electrode portions provided at both ends of a chip component are soldered, the substrate has a component mounting portion that protrudes higher than the land portions. A printed wiring board, characterized in that the printed wiring board is provided between the pair of land portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5724290U JPH0418474U (en) | 1990-06-01 | 1990-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5724290U JPH0418474U (en) | 1990-06-01 | 1990-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418474U true JPH0418474U (en) | 1992-02-17 |
Family
ID=31581779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5724290U Pending JPH0418474U (en) | 1990-06-01 | 1990-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418474U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032622A (en) * | 2004-07-15 | 2006-02-02 | Mitsubishi Electric Corp | Mounted structure of leadless package |
| JP2008060182A (en) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | In-vehicle electronic circuit device |
| JP2011142130A (en) * | 2010-01-05 | 2011-07-21 | Murata Mfg Co Ltd | Structure for mounting electronic component on mounting substrate, mounting substrate, and mounting substrate having electronic component mounted thereon |
| JP2012004590A (en) * | 2011-08-31 | 2012-01-05 | Hitachi Automotive Systems Ltd | Method for manufacturing on-vehicle electronic circuit device or electronic circuit device |
| JP2013021486A (en) * | 2011-07-11 | 2013-01-31 | Nippon Dempa Kogyo Co Ltd | Oscillator and manufacturing method of the same |
-
1990
- 1990-06-01 JP JP5724290U patent/JPH0418474U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032622A (en) * | 2004-07-15 | 2006-02-02 | Mitsubishi Electric Corp | Mounted structure of leadless package |
| JP2008060182A (en) * | 2006-08-30 | 2008-03-13 | Hitachi Ltd | In-vehicle electronic circuit device |
| JP2011142130A (en) * | 2010-01-05 | 2011-07-21 | Murata Mfg Co Ltd | Structure for mounting electronic component on mounting substrate, mounting substrate, and mounting substrate having electronic component mounted thereon |
| JP2013021486A (en) * | 2011-07-11 | 2013-01-31 | Nippon Dempa Kogyo Co Ltd | Oscillator and manufacturing method of the same |
| JP2012004590A (en) * | 2011-08-31 | 2012-01-05 | Hitachi Automotive Systems Ltd | Method for manufacturing on-vehicle electronic circuit device or electronic circuit device |