JPS6349230U - - Google Patents
Info
- Publication number
- JPS6349230U JPS6349230U JP1986142453U JP14245386U JPS6349230U JP S6349230 U JPS6349230 U JP S6349230U JP 1986142453 U JP1986142453 U JP 1986142453U JP 14245386 U JP14245386 U JP 14245386U JP S6349230 U JPS6349230 U JP S6349230U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- electrodes
- bonded
- circuit board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の一実施例を説明する図で、
同図ａはチツプ部品の斜視図、ｂは回路基板に実
装した側面図、第２図は、従来のチツプ部品を説
明するための図で、同図ａはチツプ部品の斜視図
、ｂは回路基板に実装した側面図である。
図において、１は回路基板、２はランドパター
ン、３，５はチツプ部品、４は半田、６はマーク
、３１，５１は電極、をそれぞれ示す。
FIG. 1 is a diagram illustrating an embodiment of the present invention.
Figure a is a perspective view of a chip component, b is a side view of the chip component mounted on a circuit board, and Figure 2 is a diagram for explaining a conventional chip component. Figure a is a perspective view of the chip component, and b is a circuit diagram. It is a side view mounted on a board. In the figure, 1 is a circuit board, 2 is a land pattern, 3 and 5 are chip components, 4 is solder, 6 is a mark, and 31 and 51 are electrodes, respectively.
Claims (1)
ツプ部品５の電極５１を半田４で接着するチツプ
部品であつて、 前記チツプ部品５の両電極５１の高さ方向に少
なくとも１個以上の同高のマーク６を設けたこと
を特徴とするチツプ部品。[Claims for Utility Model Registration] A chip component in which electrodes 51 of a chip component 5 are bonded with solder 4 to a land pattern 2 formed on a circuit board 1, wherein the electrodes 51 of the chip component 5 are bonded in the height direction of both electrodes 51 of the chip component 5. A chip component characterized in that at least one mark 6 of the same height is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986142453U JPS6349230U (en) | 1986-09-16 | 1986-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986142453U JPS6349230U (en) | 1986-09-16 | 1986-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6349230U true JPS6349230U (en) | 1988-04-04 |
Family
ID=31051200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986142453U Pending JPS6349230U (en) | 1986-09-16 | 1986-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6349230U (en) |
-
1986
- 1986-09-16 JP JP1986142453U patent/JPS6349230U/ja active Pending