JPS6315094U - - Google Patents
Info
- Publication number
- JPS6315094U JPS6315094U JP10816586U JP10816586U JPS6315094U JP S6315094 U JPS6315094 U JP S6315094U JP 10816586 U JP10816586 U JP 10816586U JP 10816586 U JP10816586 U JP 10816586U JP S6315094 U JPS6315094 U JP S6315094U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductive pattern
- metal frame
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図乃至第７図は本考案に係り、第１図は第
１実施例の斜視図、第２図は第１実施例の要部斜
視図、第３図は第１実施例の要部断面図、第４図
及び第５図は第２実施例の要部断面図、第６図及
び第７図は第３実施例の要部断面図である。第８
図は従来例の斜視図、第９図は従来例の要部断面
図である。
６…シールドケース（金属製枠体）、７…プリ
ント基板、９ａ，１８ａ…導電パターン、１０…
半田。
1 to 7 relate to the present invention, FIG. 1 is a perspective view of the first embodiment, FIG. 2 is a perspective view of a main part of the first embodiment, and FIG. 3 is a main part of the first embodiment. 4 and 5 are sectional views of the main parts of the second embodiment, and FIGS. 6 and 7 are sectional views of the main parts of the third embodiment. 8th
The figure is a perspective view of a conventional example, and FIG. 9 is a sectional view of a main part of the conventional example. 6... Shield case (metal frame), 7... Printed circuit board, 9a, 18a... Conductive pattern, 10...
solder.
Claims (1)
記プリント基板の一面に連なる導電パターンを設
け、該導電パターンと前記金属製枠体とを半田付
けしたことを特徴とするプリント基板取付け構造
。 A printed circuit board mounting structure characterized in that a conductive pattern connected to one surface of the printed circuit board is provided on an end surface of the printed circuit board facing the metal frame, and the conductive pattern and the metal frame are soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10816586U JPS6315094U (en) | 1986-07-15 | 1986-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10816586U JPS6315094U (en) | 1986-07-15 | 1986-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6315094U true JPS6315094U (en) | 1988-02-01 |
Family
ID=30985106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10816586U Pending JPS6315094U (en) | 1986-07-15 | 1986-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315094U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0410392U (en) * | 1990-05-17 | 1992-01-29 |
-
1986
- 1986-07-15 JP JP10816586U patent/JPS6315094U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0410392U (en) * | 1990-05-17 | 1992-01-29 |