JPH0385682U - - Google Patents
Info
- Publication number
- JPH0385682U JPH0385682U JP14726189U JP14726189U JPH0385682U JP H0385682 U JPH0385682 U JP H0385682U JP 14726189 U JP14726189 U JP 14726189U JP 14726189 U JP14726189 U JP 14726189U JP H0385682 U JPH0385682 U JP H0385682U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- connection pad
- circuit board
- printed circuit
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例によるプリント回路
基板の要部を示す図、第２図は従来のプリント回
路基板の要部を示す図、第３図は問題点を示す側
断面図である。
図において、２……チツプ部品、２ａ……電極
、１１……絶縁基板、１１−１……絶縁被膜、１
１−２……接続パツド、を示す。
Fig. 1 is a diagram showing the main parts of a printed circuit board according to an embodiment of the present invention, Fig. 2 is a diagram showing the main parts of a conventional printed circuit board, and Fig. 3 is a side sectional view showing the problem. . In the figure, 2...chip component, 2a...electrode, 11...insulating substrate, 11-1...insulating coating, 1
1-2... Indicates a connection pad.
Claims (1)
接合する接続パツド１１−２を、当該電極２ａよ
り大きな外形で前記接続パツド１１−２とで形成
される半田フイレツト３の下部のみとなる形状に
、絶縁基板１１に施された絶縁被膜１１−１の表
面に形成したことを特徴とするプリント回路基板
。 The connection pad 11-2 to be connected to the electrode 2a provided on the chip component 2 to be mounted is shaped so that it has a larger external shape than the electrode 2a and only forms the lower part of the solder fillet 3 formed by the connection pad 11-2. A printed circuit board characterized in that it is formed on the surface of an insulating coating 11-1 applied to an insulating substrate 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14726189U JPH0385682U (en) | 1989-12-20 | 1989-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14726189U JPH0385682U (en) | 1989-12-20 | 1989-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385682U true JPH0385682U (en) | 1991-08-29 |
Family
ID=31693786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14726189U Pending JPH0385682U (en) | 1989-12-20 | 1989-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385682U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008196664A (en) * | 2007-02-15 | 2008-08-28 | Obitsu Seisakusho:Kk | Valve structure and soft expansion object having the same |
-
1989
- 1989-12-20 JP JP14726189U patent/JPH0385682U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008196664A (en) * | 2007-02-15 | 2008-08-28 | Obitsu Seisakusho:Kk | Valve structure and soft expansion object having the same |
| JP4526089B2 (en) * | 2007-02-15 | 2010-08-18 | 株式会社オビツ製作所 | Valve structure and soft expansion product to which the valve structure is applied |