JPS6384978U - - Google Patents
Info
- Publication number
- JPS6384978U JPS6384978U JP18082186U JP18082186U JPS6384978U JP S6384978 U JPS6384978 U JP S6384978U JP 18082186 U JP18082186 U JP 18082186U JP 18082186 U JP18082186 U JP 18082186U JP S6384978 U JPS6384978 U JP S6384978U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- pattern portion
- electronic component
- direct
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例の部分平面図、第
２図は他の実施例の部分平面図、第３図は従来の
実装工程の説明図、第４図は従来例の平面図、第
５図は他の従来例の平面図、第６図はそのリード
レス電子部品の回転移動状態を示す平面図である
。
１，２……リードレス電子部品、３，４……直
付導電パターン部分、５，６……主導電パターン
部分、７……補助導電パターン部分、９……リー
ドレス電子部品、１０，１２，１３……直付導電
パターン部分、１１，１４，１５……主導電パタ
ーン部分、１６〜１８……補助導電パターン部分
。
Fig. 1 is a partial plan view of one embodiment of this invention, Fig. 2 is a partial plan view of another embodiment, Fig. 3 is an explanatory diagram of the conventional mounting process, Fig. 4 is a plan view of the conventional example, FIG. 5 is a plan view of another conventional example, and FIG. 6 is a plan view showing the rotational movement state of the leadless electronic component. 1, 2...Leadless electronic component, 3, 4...Direct conductive pattern portion, 5, 6...Main conductive pattern portion, 7...Auxiliary conductive pattern portion, 9...Leadless electronic component, 10, 12 , 13...Direct conductive pattern portion, 11, 14, 15...Main conductive pattern portion, 16-18...Auxiliary conductive pattern portion.
Claims (1)
導電パターン部分を設けたプリント基板において
、前記リードレス電子部品と前記直付導電パター
ン部分との間の溶融半田を流れ込ませて溶融半田
流れにより前記リードレス電子部分に位置修正力
を与える補助導電パターン部分を前記直付導電パ
ターン部分に続けて設けたことを特徴とするプリ
ント基板。 In a printed circuit board provided with a direct-attached conductive pattern portion on which a leadless electronic component is placed and soldered, molten solder flows between the leadless electronic component and the direct-attached conductive pattern portion, and the molten solder flows to connect the leads. 1. A printed circuit board, characterized in that an auxiliary conductive pattern portion for applying a position correction force to a contact electronic portion is provided following the directly attached conductive pattern portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18082186U JPS6384978U (en) | 1986-11-25 | 1986-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18082186U JPS6384978U (en) | 1986-11-25 | 1986-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6384978U true JPS6384978U (en) | 1988-06-03 |
Family
ID=31125130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18082186U Pending JPS6384978U (en) | 1986-11-25 | 1986-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384978U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012033792A (en) * | 2010-08-02 | 2012-02-16 | Mitsubishi Electric Corp | Printed wiring board, light source circuit, and lighting system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58102597A (en) * | 1981-12-15 | 1983-06-18 | 日本電気株式会社 | Electronic circuit board |
| JPS62199092A (en) * | 1986-02-27 | 1987-09-02 | 関西日本電気株式会社 | Hybrid ic |
-
1986
- 1986-11-25 JP JP18082186U patent/JPS6384978U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58102597A (en) * | 1981-12-15 | 1983-06-18 | 日本電気株式会社 | Electronic circuit board |
| JPS62199092A (en) * | 1986-02-27 | 1987-09-02 | 関西日本電気株式会社 | Hybrid ic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012033792A (en) * | 2010-08-02 | 2012-02-16 | Mitsubishi Electric Corp | Printed wiring board, light source circuit, and lighting system |