JPH01161360U - - Google Patents
Info
- Publication number
- JPH01161360U JPH01161360U JP5777388U JP5777388U JPH01161360U JP H01161360 U JPH01161360 U JP H01161360U JP 5777388 U JP5777388 U JP 5777388U JP 5777388 U JP5777388 U JP 5777388U JP H01161360 U JPH01161360 U JP H01161360U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- mounted electronic
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例のプリント基板の使
用方法を説明するための斜視図、第２図は第１図
のプリント基板を非実装面側から見た図、第３図
〜第５図は平面実装型電子部品の従来の実装方法
を説明するための斜視図である。
１……プリント基板、２，３ａ，３ｂ，３ｃ…
…平面実装型電子部品、４……電極、５ａ，５ｂ
，５ｃ……リード、６……ケースグランド部、７
ａ，７ｂ……孔、８……導体パターン。
Figure 1 is a perspective view for explaining how to use a printed circuit board according to an embodiment of the present invention, Figure 2 is a view of the printed circuit board in Figure 1 viewed from the non-mounting side, and Figures 3 to 5. The figure is a perspective view for explaining a conventional mounting method for flat-mounted electronic components. 1...Printed circuit board, 2, 3a, 3b, 3c...
...Plane-mounted electronic component, 4... Electrode, 5a, 5b
, 5c...Lead, 6...Case ground section, 7
a, 7b...hole, 8...conductor pattern.
Claims (1)
ターンに接続される電極を有する平面実装型電子
部品が実装されるプリント基板において、前記平
面実装型電子部品が実装される部位に孔が設けて
あり、該孔は前記平面実装型電子部品の底面より
やや小さいか同程度の大きさであることを特徴と
するプリント基板。 A printed circuit board on which a plane-mounted electronic component is mounted, which has a conductor pattern formed on its surface and has electrodes connected to the conductor pattern, and a hole is provided in the part where the plane-mounted electronic component is mounted. . A printed circuit board characterized in that the hole is slightly smaller or approximately the same size as the bottom surface of the flat-mounted electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5777388U JPH01161360U (en) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5777388U JPH01161360U (en) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161360U true JPH01161360U (en) | 1989-11-09 |
Family
ID=31283615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5777388U Pending JPH01161360U (en) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161360U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185655A (en) * | 1999-12-27 | 2001-07-06 | Mitsubishi Electric Corp | Microwave circuit |
| JP2002158408A (en) * | 2000-11-22 | 2002-05-31 | Canon Inc | Printed board and image forming device |
-
1988
- 1988-04-28 JP JP5777388U patent/JPH01161360U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185655A (en) * | 1999-12-27 | 2001-07-06 | Mitsubishi Electric Corp | Microwave circuit |
| JP2002158408A (en) * | 2000-11-22 | 2002-05-31 | Canon Inc | Printed board and image forming device |
| JP4590090B2 (en) * | 2000-11-22 | 2010-12-01 | キヤノン株式会社 | Printed circuit board and image forming apparatus |