JPS6395275U - - Google Patents
Info
- Publication number
- JPS6395275U JPS6395275U JP19085986U JP19085986U JPS6395275U JP S6395275 U JPS6395275 U JP S6395275U JP 19085986 U JP19085986 U JP 19085986U JP 19085986 U JP19085986 U JP 19085986U JP S6395275 U JPS6395275 U JP S6395275U
- Authority
- JP
- Japan
- Prior art keywords
- grounding
- electrical component
- plane
- pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例であるプリント基板
のパターン図、第２図は第１図のプリント基板に
電気部品を実装してなる電子回路の平面図、第３
図は従来のプリント基板の一例のパターン図、第
４図は第３図のプリント基板に電気部品を実装し
てなる電子回路の平面図である。
１……プリント基板、２，３……ホール、４…
…接地面、５……ランド、６……電気部品、７，
８……リード部、９，１０……半田、１１……接
地パターン、１２……リードパターン。
Fig. 1 is a pattern diagram of a printed circuit board that is an embodiment of the present invention, Fig. 2 is a plan view of an electronic circuit formed by mounting electrical components on the printed circuit board of Fig. 1, and Fig. 3
The figure is a pattern diagram of an example of a conventional printed circuit board, and FIG. 4 is a plan view of an electronic circuit formed by mounting electrical components on the printed circuit board of FIG. 3. 1... Printed circuit board, 2, 3... Hall, 4...
...ground plane, 5...land, 6...electrical parts, 7,
8... Lead portion, 9, 10... Solder, 11... Ground pattern, 12... Lead pattern.
Claims (1)
ードが電気的に接続される広い面積の導体パター
ンである接地面を有するプリント基板において、
前記電気部品が固着される接地用パターンと前記
接地面とが分離してあり、前記接地用パターンと
前記接地面とが１個または複数個のリードパター
ンにより接続してあることを特徴とするプリント
基板。 In a printed circuit board that has an electrical component mounted thereon and a ground plane that is a large area conductor pattern to which the ground lead of the electrical component is electrically connected,
A print characterized in that the grounding pattern to which the electrical component is fixed and the grounding plane are separated, and the grounding pattern and the grounding plane are connected by one or more lead patterns. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19085986U JPS6395275U (en) | 1986-12-11 | 1986-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19085986U JPS6395275U (en) | 1986-12-11 | 1986-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6395275U true JPS6395275U (en) | 1988-06-20 |
Family
ID=31144470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19085986U Pending JPS6395275U (en) | 1986-12-11 | 1986-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6395275U (en) |
-
1986
- 1986-12-11 JP JP19085986U patent/JPS6395275U/ja active Pending