JPH0165178U - - Google Patents

Info

Publication number
JPH0165178U
JPH0165178U JP1987159907U JP15990787U JPH0165178U JP H0165178 U JPH0165178 U JP H0165178U JP 1987159907 U JP1987159907 U JP 1987159907U JP 15990787 U JP15990787 U JP 15990787U JP H0165178 U JPH0165178 U JP H0165178U
Authority
JP
Japan
Prior art keywords
component mounting
printed board
chip component
chip
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987159907U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987159907U priority Critical patent/JPH0165178U/ja
Publication of JPH0165178U publication Critical patent/JPH0165178U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の平面図、第2図は
第1図のA―A線断面図、第3図は従来のチツプ
部品搭載プリント板の平面図である。 1……プリント板、2……チツプ部品搭載ラン
ド、3……裏面導電パターン、4……スルーホー
ルランド、5……スルーホール、X……チツプ部
品。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA in FIG. 1, and FIG. 3 is a plan view of a conventional printed circuit board on which chip components are mounted. 1... Printed board, 2... Chip component mounting land, 3... Back conductive pattern, 4... Through hole land, 5... Through hole, X... Chip component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面にチツプ部品搭載ランドを形成し、かつこ
のチツプ部品搭載ランドをスルーホールを介して
プリント板裏面の導電パターンに電気接続してな
るチツプ部品搭載プリント板において、前記スル
ーホールをチツプ部品搭載ランドの一部に配設し
たことを特徴とするチツプ部品搭載プリント板。
In a printed board for mounting chip components, in which a chip component mounting land is formed on the surface and the chip component mounting land is electrically connected to a conductive pattern on the back surface of the printed board via a through hole, the through hole is connected to the chip component mounting land. A printed board with chip components installed in a part of the board.
JP1987159907U 1987-10-21 1987-10-21 Pending JPH0165178U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987159907U JPH0165178U (en) 1987-10-21 1987-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987159907U JPH0165178U (en) 1987-10-21 1987-10-21

Publications (1)

Publication Number Publication Date
JPH0165178U true JPH0165178U (en) 1989-04-26

Family

ID=31441522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987159907U Pending JPH0165178U (en) 1987-10-21 1987-10-21

Country Status (1)

Country Link
JP (1) JPH0165178U (en)

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